Power Conversion Device Resin Cover Insulation
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Solution Overview
Problem
Miniaturization of power conversion devices for vehicles requires securing insulation and reducing electromagnetic noise interference while achieving space-saving designs, particularly in hybrid and electric automobiles.
Innovation Solution
A power conversion device with a power semiconductor module and a resin cover that includes an insulating portion between DC terminals, along with a metal member for electromagnetic noise shielding, allowing for closer component placement and reduced height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the layout distance between circuit board and power semiconductor module is increased to secure insulating distance, then insulation reliability is improved, but device volume increases
Solution Approach 1:
The patent introduces a vertical dimension solution by adding a resin cover that protrudes from the power semiconductor module housing. This cover provides the necessary insulating distance in the vertical direction rather than increasing horizontal layout distance, allowing components to be closely disposed horizontally while maintaining insulation requirements through vertical separation.
Solution Approach 2:
The resin cover acts as an intermediary insulating structure between the power semiconductor module and the circuit board. It physically separates these components and provides the required insulating distance, enabling close component placement while ensuring insulation reliability without direct contact between conductive elements.
2Volume of stationary object
If components are closely disposed to achieve miniaturization, then device volume is reduced, but electromagnetic noise interference increases
Solution Approach 1:
The metal member serves as an electromagnetic shielding intermediary between power supply lines and other components. It intercepts and redirects electromagnetic noise generated by high-current power traces, preventing this noise from interfering with sensitive circuit elements in the closely disposed miniaturized device.
Solution Approach 2:
The thin metal member is positioned to cover power supply lines in a flexible shielding configuration. This thin film structure effectively blocks electromagnetic noise without adding significant volume, enabling miniaturization while maintaining electromagnetic compatibility.
3Volume of stationary object
If the height of the back surface of housing is reduced for space saving, then device volume is reduced, but insulation distance is compromised
Solution Approach 1:
The resin cover extends in the vertical direction (height dimension) to provide the necessary insulating distance. This allows the back surface of the housing to remain low for space saving, while the protruding cover creates vertical separation between power terminals and the circuit board, maintaining insulation distance without increasing overall device volume.
Solution Approach 2:
The resin cover is pre-formed as an integrated part of the power semiconductor module assembly before final device assembly. This preliminary structure ensures that insulation requirements are already satisfied in the design stage, allowing the housing back surface to be minimized for space saving without compromising insulation distance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the miniaturization of power conversion devices by ensuring insulation and reducing electromagnetic noise interference, allowing for closer placement of semiconductor modules and circuit boards while maintaining effective noise shielding.
Implementation Method 1
a resin cover portion (700) which includes an insulating portion (701) disposed between the DC positive terminal (340p) and the DC negative terminal (340n), and holds a metal member (750) which covers the DC positive terminal (340p) and the DC negative terminal (340n)
Data Source
AI summary
An object of the invention is to provide a power conversion device which secures insulation and is miniaturized still more without being affected by electromagnetic noises. A power conversion device according to the invention includes a power semiconductor module which converts a DC current into an AC current and includes a DC positive terminal and a DC negative terminal, and a resin cover portion which includes an insulating portion disposed between the DC positive terminal and the DC negative terminal. The cover portion holds a metal member which covers the DC positive terminal and the DC negative terminal.