Power Conversion Module Inductor Pin Integration
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Solution Overview
Problem
Conventional DC-to-DC converters with three-dimensional layouts face increased material and fabrication costs due to additional processing steps and suffer from electromagnetic interference (EMI) issues, affecting performance and efficiency.
Innovation Solution
A power conversion module design featuring a circuit carrier board with bonding pads or perforations, a semiconductor module, and an inductor module with pins or L-shaped pins that are integrated during fabrication, reducing EMI through simultaneous production of pins and bonding pads, and incorporating shielding layers for electromagnetic interference reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If four post-like or ball-like structures are formed on the circuit carrier board to support the inductor, then the three-dimensional layout configuration is achieved and the circuit carrier board area is reduced, but the material cost and fabricating cost are increased due to additional processing steps
Solution Approach 1:
The inductor module is integrated with the circuit carrier board by forming pins directly on the inductor module that connect to bonding pads on the board, merging two previously separate components into a unified structure. This eliminates the need for additional post-like support structures and reduces fabrication steps while maintaining the three-dimensional layout configuration.
2Area of stationary object
If the inductor is soldered on four post-like or ball-like structures to achieve three-dimensional layout, then the circuit carrier board area is reduced, but electromagnetic interference problem occurs affecting performance and operating efficiency
Solution Approach 1:
The harmful electromagnetic interference effect is extracted and eliminated by removing the inductor from its traditional position on post-like structures and repositioning it within a dedicated receptacle formed between the inductor module and circuit carrier board. This spatial reconfiguration reduces EMI while maintaining the compact three-dimensional layout.
3Shape
If additional process is required to form post-like or ball-like structures on the circuit carrier board, then the three-dimensional layout is achieved, but the fabrication process complexity and cost are increased
Solution Approach 1:
The fabrication processes for the inductor module and circuit carrier board are merged into a simultaneous production process. The pins of the inductor module are formed and connected to bonding pads in the same manufacturing step, eliminating the need for separate post-formation processes and reducing overall fabrication complexity while achieving the three-dimensional layout configuration.
Data Source
AI summary
A power conversion module includes a circuit carrier board, a semiconductor module and an inductor module. The circuit carrier board has plural bonding pads. The semiconductor module is disposed on a first surface of the circuit carrier board. The inductor module has plural pins. The pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.