Power Conversion Unit Vertical Module Alignment
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Solution Overview
Problem
The existing power conversion devices with horizontally arranged power semiconductor modules increase the footprint due to the placement of heavy components, such as reactors, which necessitates a wider layout.
Innovation Solution
A power conversion unit is designed with a circuit connection section where the first and second power semiconductor modules, along with a capacitor, are connected in a configuration that allows their external terminals to be aligned in a straight line, reducing the horizontal footprint by orienting the modules vertically and placing heavy components below, thus minimizing the device's width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If power semiconductor modules are arranged horizontally to connect heavy components below, then the device footprint increases, but if arranged vertically, then the footprint is reduced
Solution Approach 1:
The patent transitions from horizontal arrangement to vertical arrangement of power semiconductor modules, changing the spatial dimension of component layout. This vertical stacking allows heavy components like reactors to be positioned below while reducing the horizontal footprint of the entire device.
Solution Approach 2:
Instead of the conventional horizontal arrangement where heavy components are placed at the sides, the patent inverts this by positioning heavy components vertically below the power semiconductor modules, fundamentally changing the spatial relationship and reducing footprint.
2Power
If power semiconductor modules are connected in parallel to output rated current, then the current capacity increases, but the current balance between modules becomes difficult to maintain
Solution Approach 1:
The patent introduces local quality variations in the connection structure by providing separate connection sections for each power semiconductor module, with individual positive and negative conductors for each module. This localized connection approach ensures equal current distribution paths while maintaining parallel connection for increased current capacity.
Data Source
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AI summary
The present invention reduces the footprint of a power conversion device. A first power semiconductor module (111) and a second power semiconductor module (112) are connected to a positive conductor (152), a negative conductor (153), and an alternating-current conductor (154). An external alternating-current terminal (154T), the first power semiconductor module, the second power semiconductor module, a capacitor (121, 122), and an external direct-current terminal (131b, 132b) including an external positive terminal and an external negative terminal are arrayed on a straight line extending in the longitudinal direction of a circuit connection section. The external alternating-current terminal is disposed at one longitudinal end of the circuit connection section. The external direct-current terminal is disposed at the other longitudinal end of the circuit connection section.