Power Converter Layout With Airflow Cooling for Low Resistance
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Solution Overview
Problem
The existing power conversion apparatuses face a trade-off between heat damage to transistors and increased overall resistance due to excessive spacing of transistors, which affects heat dissipation efficiency.
Innovation Solution
The power conversion apparatus is designed with a housing that includes a heat sink and capacitors positioned to allow smooth air flow to the heat sink, preventing excessive spacing of transistors and maintaining low resistance, while also incorporating an air blocking unit and an air guide to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If transistors are disposed to be spaced apart to prevent heat damage, then heat dissipation is improved, but overall resistance increases
Solution Approach 1:
The patent divides the housing into multiple regions (first region, second region, third region) with distinct functions. Transistors are placed in the first region, heat-generating components in the second region, and air intake is directed through the third region. This spatial segmentation allows transistors to be positioned closer together without excessive heat exposure while maintaining low resistance, as the heat sources are physically separated into different zones.
Solution Approach 2:
The patent introduces air as an intermediary cooling medium that flows through designated passages. Air intake holes and air outlet holes create a controlled airflow path that carries heat away from transistors without requiring them to be spaced far apart. The airflow acts as a thermal mediator, enabling compact transistor placement while maintaining effective heat dissipation.
2Reliability
If transistors are disposed close together to maintain low resistance, then resistance is reduced, but heat damage to transistors increases
Solution Approach 1:
The patent extracts the heat-generating function from the transistor locations by placing heat-generating components (such as power semiconductor devices) in a separate second region. This extraction allows transistors to be positioned close together in the first region for low resistance without being damaged by heat, as the heat sources have been removed from the immediate vicinity of the transistors.
Solution Approach 2:
The patent employs pneumatic cooling through controlled air flow. Air intake holes allow cool air to enter the housing, and air outlet holes enable heated air to escape. This pneumatic system creates a continuous airflow that cools transistors, allowing them to be disposed close together for low resistance while preventing heat damage through active air cooling.
3Temperature
If air flow path is extended to improve cooling, then heat dissipation improves, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the housing structure itself. The housing serves as both the mechanical enclosure and the thermal management system. Air intake holes, air outlet holes, and internal passages are integrated directly into the housing walls, eliminating the need for separate cooling channels or ducts. This merging achieves effective heat dissipation through extended air flow paths while maintaining simple overall structure.
Solution Approach 2:
The housing performs multiple functions simultaneously: it provides mechanical support, defines component mounting positions, and serves as the thermal management system through integrated air intake and outlet holes. The same structural elements that form the housing also create the cooling passages, achieving multi-functionality that improves heat dissipation without adding separate cooling components or increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency, prevents transistor damage from heat, and maintains low resistance in the power conversion apparatus, while also enhancing installation and replacement convenience.
Implementation Method 1
a heat sink disposed on one side of the plurality of transistors and providing a passage through which air introduced from the outside moves
Data Source
AI summary
A power conversion apparatus is disclosed. The power conversion apparatus according to one aspect of the present disclosure may include: a housing including an upper part, a lower part disposed in parallel with the upper part, a first side part connecting the upper part with the lower part, and a second side part disposed in parallel with the first side part; a plurality of transistors disposed adjacent to the first side part inside the housing; a heat sink disposed on one side of the plurality of transistors and providing a passage through which air introduced from the outside moves; and a plurality of capacitors disposed in front of the heat sink, wherein the plurality of capacitors may be disposed to be spaced apart from each other so that air introduced from the outside of the housing moves to the heat sink.