Power Converter Cooling via Segmented Casing Vents
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Solution Overview
Problem
Conventional electric power conversion apparatuses face challenges in cooling high-density main circuit boards due to reduced gaps between components, leading to inefficient natural convection, dust-related short-circuits, and the need for significant installation space, which compromises cooling performance and safety.
Innovation Solution
An electric power conversion apparatus with a box-shaped main body casing featuring opening portions on upper and lower surfaces, a cooling fan, and an upper surface cover that directs air flow to enhance cooling efficiency while preventing dust ingress, allowing for compact installation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the main circuit board is mounted with high density to reduce apparatus size, then the apparatus size is reduced, but the gaps among components are reduced making cooling air flow difficult
Solution Approach 1:
The invention divides the cooling function into two independent systems: (1) cooling fins with cooling fans for semiconductor devices, and (2) opening portions in the main body casing for main circuit board cooling. This segmentation allows each system to be optimized independently, enabling high-density mounting while maintaining effective cooling paths for both components.
Solution Approach 2:
The opening portions in the main body casing act as intermediaries that facilitate cooling air flow to the main circuit board without requiring large gaps between densely mounted components. These openings create dedicated cooling channels that bypass the component density constraint, allowing cooling air to reach the circuit board effectively.
2Temperature
If opening portions are provided in the main body casing for cooling the main circuit board, then cooling performance is improved, but dust enters the casing causing short-circuits
Solution Approach 1:
The invention merges the cooling function with the protective function by integrating opening portions into the main body casing structure itself. The casing serves dual purposes: providing structural protection while incorporating cooling openings that enable heat dissipation without compromising reliability when properly designed.
Solution Approach 2:
The opening portions are strategically positioned and sized to provide adequate cooling airflow to the main circuit board while minimizing dust ingress. The local design of these openings balances cooling performance with protection, creating controlled access points for cooling air rather than large open areas.
3Device complexity
If natural convection cooling is used for densely mounted components, then the structure is simple, but cooling efficiency is insufficient
Solution Approach 1:
The invention segments the cooling approach by using natural convection through opening portions for the main circuit board while employing forced convection with cooling fans for semiconductor devices. This segmentation allows each component type to receive appropriate cooling intensity based on its heat generation characteristics.
Solution Approach 2:
The opening portions enable the main circuit board to cool itself through natural convection of air passing through the casing openings, without requiring additional active cooling components. This self-service cooling mechanism maintains structural simplicity while improving cooling efficiency for densely mounted components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves cooling efficiency, reduces installation space requirements, and enhances safety by ensuring effective heat dissipation and preventing dust-related issues, thereby providing reliable operation at a lower cost.
Implementation Method 1
air from the cooling fan rectified by the upper surface cover is flowed near surfaces of the opening portions
Implementation Method 2
a cooling fin for radiating heat of the semiconductor
Implementation Method 3
a heat pipe 9 passing through the partitions 8a and 8b and including a heat radiating section 7
Implementation Method 4
cooling of heat generated by a loss generated when electric power is converted
Data Source
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AI summary
An electric power conversion apparatus includes a semiconductor, a main circuit board having a circuit for driving the semiconductor, a casing housing the semiconductor and the main circuit board and having at least one surface in which an opening portion is provided, and a cover that is provided to have a predetermined gap between the cover and the opening portion of the casing.