Power Converter Cooler with Segmented Refrigerant Channels

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Solution Overview

Problem

Existing power conversion apparatuses for hybrid and electric cars face challenges in efficiently cooling semiconductor modules, particularly those using IGBTs, which generate significant heat, leading to degradation in cooling performance due to uneven heat distribution across the cooling structure.

Innovation Solution

The apparatus employs a cooler with a refrigerant channel divided into an outgoing and an incoming channel, with semiconductor modules generating higher power positioned over the outgoing channel and those generating lower power over the incoming channel, optimizing the flow velocity and heat-transfer coefficient to distribute heat effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a water-cooling cooler is used with semiconductor modules arranged in a single refrigerant channel, then the cooling structure is simple, but the cooling performance degrades due to heat concentration from upstream modules affecting downstream modules

Engineering Contradiction:
Improvecooling structure complexityVSAvoidcooling performance
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The single refrigerant channel is segmented into multiple channels (first refrigerant channel and second refrigerant channel) with separate inlet and outlet ports. This segmentation allows independent cooling paths for different semiconductor modules, preventing heat concentration from upstream modules from degrading downstream module cooling performance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different refrigerant channels are configured with different flow rates and cooling capacities matched to the specific heat generation characteristics of semiconductor modules in each position. High-power modules receive higher flow rates, while low-power modules receive lower flow rates, optimizing cooling efficiency for each local region.

Inventive Principle:
Principle #3Local quality

2Reliability

If high flow rate is used to cool high-power semiconductor modules, then cooling effectiveness improves, but energy loss increases

Engineering Contradiction:
Improvecooling effectivenessVSAvoidcooling energy loss
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The cooling system provides localized cooling with different flow rates for different refrigerant channels. High-power semiconductor modules are supplied with higher flow rates through dedicated channels, while low-power modules receive lower flow rates, optimizing cooling effectiveness while minimizing overall energy loss.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The system changes the flow rate parameter of the refrigerant based on the power generation characteristics of different semiconductor modules. By adjusting flow rates to match actual heat generation needs, the system achieves optimal cooling effectiveness while reducing unnecessary energy consumption.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the overall cooling performance by ensuring that high-power semiconductor modules are cooled efficiently, reducing thermal variations and improving the apparatus's ability to manage heat generation across the power conversion system.

Implementation Method 1

a cooler (52)

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

optimizing the flow velocity and heat-transfer coefficient to distribute heat effectively

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS9204573B2Power conversion apparatus
Publication Date: 2015.12.01 KK TOSHIBA
  • US9204573B2 patent drawing
  • US9204573B2 patent drawing
  • US9204573B2 patent drawing

AI summary

In general, according to an embodiment, a power conversion apparatus includes a first inverter, second inverter and a cooler. The first inverter includes a plurality of semiconductor devices connected together in parallel per phase. In the second inverter, the number of parallel-connected semiconductor devices are two or more per phase, the semiconductor devices are connected together in parallel and the number of parallel-connected semiconductor devices in the second inverter is fewer than that in the first inverter per phase. The semiconductor devices in the first inverter are installed in an area of a cooling surface of the cooler positioned over a first channel. The semiconductor devices in the second inverter are installed in an area of the cooling surface positioned over the second channel.