Power Device Refrigerant Chamber for High-Density Heat Dissipation
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Solution Overview
Problem
High-power semiconductor devices generate significant heat, leading to increased heat flow density, which poses a challenge for heat dissipation, especially in miniaturized and integrated power devices, limiting their use environment and performance.
Innovation Solution
A heat dissipation system utilizing a refrigerant-filled chamber and condenser for phase-change heat exchange, where heat is conducted from the power component to a refrigerant, vaporized, and then condensed back into a liquid state, cycling without pumps, with a design that includes flow nozzles and evaporators to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the power device is miniaturized and integrated, then the device size is reduced, but the heat dissipation capability deteriorates due to limited space for heat dissipation assembly
Solution Approach 1:
The refrigerant chamber is nested within the base of the power device, with the refrigerant circulation path integrated into the base structure. The condenser is positioned to receive vapor from the chamber, creating a compact nested arrangement that provides effective heat dissipation without adding external heat dissipation assemblies.
Solution Approach 2:
The patent utilizes phase change of refrigerant (liquid to vapor and back to liquid) within the confined space of the base. The refrigerant absorbs heat from the power component by vaporizing in the chamber, then condenses back to liquid in the condenser, releasing heat. This phase transition mechanism enables high heat dissipation capability in a miniaturized device without requiring large heat dissipation assemblies.
2Power
If high-power semiconductor devices are used to improve computing capability, then power consumption increases, but heat dissipation becomes more difficult due to increased heat flow density
Solution Approach 1:
The refrigerant acts as an intermediary heat transfer medium between the power component and the external environment. Heat from the high-power component is transferred to the refrigerant in the chamber, which then transports the heat to the condenser for dissipation. This intermediary mechanism efficiently manages high heat flow density without requiring complex heat dissipation systems.
Solution Approach 2:
The patent employs a refrigerant circulation system where phase change drives the heat transfer process. The refrigerant vaporizes to absorb heat from the power component, then condenses to release heat externally. This pneumatic-hydraulic approach using refrigerant circulation provides an effective solution for managing heat from high-power devices without increasing device complexity.
3Device complexity
If conventional heat dissipation methods are used, then the heat dissipation structure is simple, but the heat dissipation efficiency is insufficient for high power density
Solution Approach 1:
The patent employs phase change of refrigerant (liquid-vapor transition) within the base to achieve high heat dissipation efficiency. The refrigerant absorbs latent heat during vaporization in the chamber and releases latent heat during condensation in the condenser, enabling effective heat removal from high-power components without requiring complex external heat dissipation structures.
Solution Approach 2:
The patent changes the thermal state parameters of the refrigerant (temperature, pressure, phase) to optimize heat transfer. By controlling the refrigerant's phase transition and circulation, the system achieves high heat dissipation efficiency. The refrigerant chamber and condenser are positioned to maximize thermal exchange, improving heat dissipation performance without increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces thermal resistance and improves heat dissipation capability, enhancing the performance and competitiveness of power devices by efficiently managing high heat densities.
Implementation Method 1
The refrigerant may be heated and vaporized into vapor, and the vapor may be cooled and condensed into the liquid refrigerant
Implementation Method 2
The liquid refrigerant is heated and vaporized to form the vapor
Implementation Method 3
The vapor enters the condenser, and flows back to the first chamber after the vapor is condensed into a liquid state
Implementation Method 4
heat may be conducted from the power component to the first surface of the base, and may be further conducted to the liquid refrigerant in the first chamber of the base
Implementation Method 5
the refrigerant in the first chamber may flow back to the first chamber under an action of gravity after the refrigerant is condensed into the liquid state by the condenser
Data Source
AI summary
A heat dissipation system and a power device. The heat dissipation system may include a power module and a condenser. The power module may include a base and a power component, the base has a first chamber, and the first chamber is filled with a refrigerant. The power component is disposed on a first surface of the base, and the power component is in thermally conductive contact with the first surface. Heat generated by the power component may be transferred from the first surface to the first chamber, and is further conducted to the refrigerant, and the refrigerant may be heated and vaporized into vapor. In addition, the condenser communicates with the first chamber, and the vaporized refrigerant may enter the condenser. The refrigerant condensed into a liquid state by the condenser may flow back to the first chamber.