Power Electronic Conversion System Thermal Management
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Solution Overview
Problem
Current power electronic conversion systems face challenges with high thermal conduction resistance due to rough cooling plates, complex manufacturing and assembly processes, and interference with cooling medium flow patterns, leading to inefficiencies and increased costs.
Innovation Solution
A power electronic conversion system design featuring a mounting plate with a vertical riser to support electronic components, a thermal pad to reduce contact resistance, and a cold plate with internal fins for improved heat transfer, potentially integrated via additive manufacturing for simplified assembly and enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a cooling plate with rough surface is used, then manufacturing is simpler, but thermal conduction resistance increases
Solution Approach 1:
A thermal pad is introduced as an intermediary layer between the electronic component and the cooling plate. This thermal pad compensates for the rough surface of the cooling plate, ensuring good thermal contact without requiring high manufacturing precision of the cooling plate itself, thus resolving the contradiction between ease of manufacture and thermal conduction performance
Solution Approach 2:
The invention changes the physical state and properties of the contact interface by using a compressible thermal pad that can deform to fill surface irregularities. This parameter change in the contact interface properties allows the cooling plate to maintain good thermal contact despite having a rough surface, resolving the contradiction between manufacturing simplicity and thermal performance
2Strength
If complex mounting methods such as punching holes on the cold plate are used, then electronic components can be securely mounted, but flow patterns of the cooling medium are interfered with
Solution Approach 1:
The mounting function is separated from the cooling plate by introducing a独立的 mounting plate. This segmentation allows the cooling plate to remain intact without holes, preserving cooling medium flow patterns, while the mounting plate provides secure mounting for electronic components through its own structural features
Solution Approach 2:
A mounting plate is introduced as an intermediary component between the cooling plate and electronic components. This mediator provides mounting functionality without requiring modifications to the cooling plate, thus avoiding interference with cooling medium flow while still achieving secure component mounting
3Manufacturing precision
If complex manufacturing processes of the cooling plate are used, then thermal contact performance improves, but delivery time increases
Solution Approach 1:
A thermal pad is introduced as a simple intermediary component that compensates for cooling plate surface roughness without requiring complex manufacturing processes. This allows the cooling plate to be manufactured using simpler, faster processes while still achieving good thermal contact performance through the compliant thermal pad
Solution Approach 2:
The invention changes the approach to achieving thermal contact by using a compressible thermal pad instead of requiring high-precision machining of the cooling plate. This parameter change in the contact mechanism allows for faster manufacturing and shorter delivery times while maintaining thermal performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency, reduces assembly time and costs, and minimizes interference with cooling medium flow, addressing the inefficiencies and complexities of existing systems.
Implementation Method 1
The first thermal pad is disposed between the first electronic component and the first vertical riser to reduce a contact resistance
Implementation Method 2
the cold plate is configured to remove the heat from the electronic components via a cooling medium within in the cold plate
Implementation Method 3
a cold plate with internal fins for improved heat transfer
Data Source
AI summary
A power electronic conversion system includes a first electronic component that generates heat; a mounting plate comprising a horizontal plate and a first vertical riser with vertical configuration, wherein the first vertical riser is configured to mount the first electronic component; a first thermal pad disposed between the first electronic component and the first vertical riser to reduce a contact resistance; and a cold plate coupled to the mounting plate and comprised at least one cooling medium passage defined by a plurality of internal fins.