Integrated Power Electronics Assembly With Alignment Marks

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Solution Overview

Problem

The manufacture of multi-layer PCBs is challenging due to difficulties in aligning and assembling power devices within substrate pockets, leading to positional variations that affect subsequent fabrication processes.

Innovation Solution

The use of alignment marks and fixtures to align power devices and substrates, ensuring precise assembly alignment through alignment marks on lead frames and bonding fixtures, allowing power devices to be positioned accurately within pockets and substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If multi-layer PCBs are designed to incorporate higher capacity and density of electronic components, then the footprint is reduced, but the design and manufacture becomes difficult

Engineering Contradiction:

Improvedensity of electronic componentsVSAvoiddifficulty of manufacture

Core Design Contradiction:

Quantity of substanceVSEase of manufacture

Solution Approach 1:

The invention segments the manufacturing process into distinct stages: preparing the lead frame with alignment marks, preparing the bonding fixture with corresponding alignment marks, and then assembling power devices through aligned openings and pockets. This segmentation allows each component to be manufactured and prepared independently with precise alignment features, making the overall complex multi-layer PCB manufacturing more manageable and repeatable

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention replaces traditional mechanical alignment methods with a precision fixture system that uses alignment marks (apertures) to automatically register components. The bonding fixture with aligned openings and the lead frame with alignment marks create a self-aligning mechanical system that reduces manual adjustment and improves manufacturing ease

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If power devices are assembled without precise alignment marks, then the assembly process is simpler, but positional variations affect subsequent fabrication processes

Engineering Contradiction:

Improvesimplicity of assembly processVSAvoidpositional accuracy of power devices

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The invention applies preliminary action by pre-establishing alignment marks (apertures) on both the lead frame and bonding fixture before the actual power device assembly. These alignment marks are registered in advance to ensure that when power devices are placed through the openings into the pockets, they achieve precise positioning automatically, eliminating the need for complex real-time alignment during assembly

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS12581960B2Highly integrated power electronics and methods of manufacturing the same

Publication Date: 2026.03.17 MIRISE TECH CORP

AI summary

A method for manufacturing a power device fabrication panel includes aligning a first alignment mark in a lead frame of a power device substrate array with a second alignment mark in a bonding fixture. The power device substrate array includes a plurality of power device pockets, the bonding fixture includes a plurality of power device openings, and the power device openings are in assembly alignment with the power device pockets when the first alignment mark is aligned with the second alignment mark. And with the bonding fixture power device openings in assembly alignment with the power device pockets of the power device substrate array, a plurality of power devices are moved at least partially through the aligned power device openings and into the power device pockets where they are bonded.