Power Electronics Module with Embedded Liquid Coolers
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Solution Overview
Problem
Wide bandgap semiconductor devices, such as SiC, require new packaging concepts due to their different design and operation properties compared to Si devices, necessitating enhanced cooling, insulation, and protection from high voltage and temperature stresses, as well as synchronization of multiple parallel devices.
Innovation Solution
A power electronics module with liquid coolers and semiconductor chips embedded in an insulating encapsulation, providing direct thermal contact and electrical insulation, and featuring a double-stacked configuration with intermediate coolers for improved thermal management and reduced partial discharges, allowing for efficient cooling and insulation suitable for high voltage applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If wide bandgap semiconductor devices are used for high voltage applications, then higher blocking voltages and lower switching losses are achieved, but enhanced cooling and insulation are required due to higher loss densities and temperature stresses
Solution Approach 1:
The module is divided into multiple semiconductor chips arranged in series between the coolers, allowing the high voltage blocking capability to be distributed across multiple lower-voltage devices. This segmentation also distributes the thermal load across multiple cooling contact points, reducing temperature stress on individual devices
Solution Approach 2:
Electrically insulating material is introduced as an intermediary between the semiconductor chips and the cooler surfaces. This intermediary layer provides electrical insulation to prevent discharge while maintaining thermal contact through the encapsulation, addressing both the high voltage insulation requirement and the cooling requirement simultaneously
2Temperature
If semiconductor chips are directly bonded to coolers for efficient heat dissipation, then cooling performance is improved, but electrical insulation and protection from partial discharges are compromised
Solution Approach 1:
An electrically insulating material is placed between the semiconductor chip and the cooler surface to prevent electrical discharge and partial discharges. This intermediary layer maintains electrical isolation while the encapsulation ensures thermal coupling, thus protecting against harmful electrical effects while preserving cooling performance
Solution Approach 2:
The module uses a composite structure combining electrically insulating material with thermally conductive encapsulation material. The insulating layer provides electrical protection against partial discharges, while the thermally conductive encapsulation ensures efficient heat transfer to the coolers, simultaneously addressing both electrical and thermal requirements
3Power
If multiple semiconductor devices are connected in series for high voltage operation, then higher blocking voltages are achieved, but the complexity of synchronization and gate driver coordination increases
Solution Approach 1:
Multiple semiconductor chips are merged into a single integrated module package with common cooling and encapsulation. The series-connected chips share common gate driver connections and cooling infrastructure, reducing the overall system complexity compared to separate modules while maintaining high voltage blocking capability through series connection
4Ease of manufacture
If conventional packaging is used for SiC devices, then manufacturing simplicity is maintained, but the different design properties of wide bandgap devices are not adequately addressed
Solution Approach 1:
The packaging design applies different material properties to different locations: electrically insulating material at the chip-cooler interface for electrical protection, and thermally conductive encapsulation material for heat dissipation. This local differentiation of material qualities addresses the specific operational requirements of wide bandgap devices under high voltage and temperature conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves effective cooling and enhanced electrical insulation, reducing the need for additional protection and allowing for compact, reliable high-voltage power electronics modules with improved switching capabilities and reduced risk of partial discharges.
Implementation Method 1
a first and a second liquid cooler 12a, 12b and a plurality of semiconductor chips 14 between the coolers 12a, 12b
Implementation Method 2
a first liquid cooler 12a, 12b and a plurality of semiconductor chips 14 between the coolers 12a, 12b, wherein the first liquid cooler 12a comprises a cooling channel for receiving a cooling liquid
Implementation Method 3
The plurality of semiconductor chips 14 and the first and second liquid coolers 12a, 12b are embedded into an insulation material 16
Data Source
AI summary
A power electronics module comprises a first liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the first liquid cooler comprises a metal body providing a first terminal of the power electronics module; a second liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the second liquid cooler comprises a metal body providing a second terminal of the power electronics module; a plurality of semiconductor chips arranged between the first liquid cooler and the second liquid cooler, such that a first electrode of each semiconductor chip is bonded to the first liquid cooler, such that the first electrode is in electrical contact with the first liquid cooler, and an opposite second electrode of each semiconductor chip is in electrical contact with the second liquid cooler; and an insulating encapsulation, formed by molding the first liquid cooler, the second liquid cooler and the plurality of semiconductor chips into an insulation material, such that the first liquid cooler, the second liquid cooler and the plurality of semiconductor chips are at least partially embedded onto the insulation material.