Power Interposer for IC Power Delivery and Signal Routing
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Solution Overview
Problem
The increasing demand for processor performance leads to higher power consumption and I/O signal congestion in computing systems, with existing voltage regulator modules either occupying valuable space or limiting thermal management, and integrated voltage regulators reducing processing yield and design flexibility.
Innovation Solution
The implementation of processor modules with a power interposer that attaches voltage regulator modules parallel to the integrated circuit component, routing regulated power signals through the interposer to avoid I/O signal congestion and allow for flexible thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If voltage regulator modules are integrated into integrated circuit components, then power delivery is improved, but processing yield and design flexibility are reduced
Solution Approach 1:
The system is divided into separate functional modules: voltage regulator modules (VRMs) are detached from the system board and integrated circuit components (ICs), with an interposer introduced as a separate entity to bridge them. This segmentation allows each component to be optimized independently, improving processing yield while maintaining flexible power delivery design.
Solution Approach 2:
An interposer is introduced as an intermediary component between the VRM and the IC. The interposer provides the electrical connection interface, allowing the VRM to be positioned optimally for thermal management and power delivery without constraining the IC design or reducing processing yield.
2Power
If voltage regulator modules are placed on the system board, then power regulation is achieved, but I/O signal congestion increases
Solution Approach 1:
The voltage regulator modules are extracted from the system board and repositioned to attach directly to the interposer, which is connected to the IC. This extraction removes the VRM from the system board's signal routing path, eliminating the congestion it caused for I/O signals while maintaining power regulation functionality.
3Productivity
If processor performance is increased, then computing capability is improved, but power consumption and thermal demands increase
Solution Approach 1:
The system enables dynamic thermal management by allowing the VRM to be positioned optimally near the IC's thermal interface. This dynamic configuration allows for efficient heat dissipation paths to be established, accommodating increased thermal demands from higher processor performance without compromising reliability.
4Power
If system board space is used for voltage regulator modules, then power delivery is simplified, but space for other components is reduced
Solution Approach 1:
The voltage regulator modules are taken out from the system board and relocated to attach to the interposer near the IC. This extraction frees up valuable system board space for other components while maintaining simplified power delivery through the direct VRM-to-IC connection path.
Data Source
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AI summary
A processor module comprises an integrated circuit component attached to a power interposer. One or more voltage regulator modules attach to the power interposer via interconnect sockets and the power interposer routes regulated power signals generated by the voltage regulator modules to the integrated circuit component. Input power signals are provided to the voltage regulator from the system board via straight pins, a cable connector, or another type of connector. The integrated circuit component's I/O signals are routed through the power interposer to a system board via a socket located between the power interposer and the socket. Not having to route regulated power signals from a system board through a socket to an integrated circuit component can result in a system board with fewer layers, which can reduce overall system cost, as well as creating more area available in the remaining layers for I/O signal entry to the socket.