Common-Housing Power Module Assembly for Scalable Current
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Solution Overview
Problem
Existing power semiconductor modules face challenges in efficiently scaling electrical current and reducing production complexity and reject rates, particularly for high-power applications, due to complex design, high manufacturing costs, and logistical difficulties in connecting multiple circuits.
Innovation Solution
A power semiconductor module system with a common housing that surrounds two power semiconductor modules, featuring multiple contact electrodes and contacting regions, allowing easy mechanical and electrical connection of autonomous modules without altering the semiconductor circuits, and enabling pre-production testing and simplified cooling systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the power of a power semiconductor module is increased by using a larger power semiconductor circuit, then the required semiconductor surface is provided, but the module volume increases and the volumes for power semiconductor modules fall with increasing maximum module rated current
Solution Approach 1:
The patent divides the power semiconductor module into multiple independent circuit carriers (DCBs), each containing a power semiconductor circuit. These modular units can be independently produced, tested, and assembled, allowing power scaling without proportionally increasing overall module volume.
Solution Approach 2:
The patent transitions from a single-plane circuit layout to a three-dimensional stacked arrangement of multiple circuit carriers vertically positioned on the baseplate. This vertical stacking enables increased power capacity without proportional increase in horizontal module volume.
2Power
If the module size increases to provide larger semiconductor surface, then higher currents are achieved, but the complexity of the module increases disproportionately
Solution Approach 1:
The module is segmented into identical or similar circuit carrier units, each with standardized interfaces and structures. This modular approach allows complex high-current functionality to be achieved by repeating simple, well-understood circuit units, thereby managing complexity through standardization.
Solution Approach 2:
The circuit carriers are designed as universal modules that can be used in different configurations and applications. Each carrier serves multiple functions including power switching, heat dissipation, and electrical connection, reducing the need for specialized components and simplifying the overall module design.
3Power
If multiple power semiconductor circuits are connected in parallel to increase power, then sufficient semiconductor surface is provided, but the design effort for baseplate and housing increases and production process complexity increases
Solution Approach 1:
The production process is segmented into independent stages: circuit carrier fabrication, baseplate preparation, and final assembly. Each circuit carrier can be manufactured and pre-tested separately using standardized processes, reducing the complexity of simultaneous multi-circuit fabrication and enabling modular assembly.
Solution Approach 2:
Circuit carriers are pre-produced and pre-tested as independent units before final module assembly. This preliminary fabrication and testing of modular components simplifies the final assembly process and reduces production complexity by eliminating the need for complex in-situ fabrication and testing of the complete module.
4Power
If power semiconductor circuits are connected in parallel, then higher power is achieved, but busbar and cooling system must be specially developed to ensure sufficient static and dynamic power symmetry
Solution Approach 1:
The busbar structure and cooling system are merged into an integrated baseplate design that serves both electrical connection and thermal management functions. This unified approach ensures that power distribution and heat dissipation are symmetrically arranged, maintaining power symmetry without requiring separate complex busbar and cooling system designs.
Solution Approach 2:
The baseplate serves multiple functions simultaneously: mechanical support, electrical connection via busbars, and thermal management via cooling channels. This multi-functional design simplifies the overall system by eliminating the need for separate specially-developed busbar and cooling system components.
5Reliability
If power semiconductor module is broken down into smaller subunits for pre-testing, then production rejects are reduced, but the assembly process requires adding further components and full electrical testing after assembly
Solution Approach 1:
The module is divided into circuit carrier subunits that can be independently tested, improving yield by identifying defects at the component level. The standardized modular design minimizes assembly complexity by using uniform interfaces and pre-integrated components, reducing the number of additional components needed during final assembly.
Data Source
AI summary
A method for producing a power semiconductor module system includes producing a first and second power semiconductor modules that each have a power semiconductor circuit, connecting first and second contact electrodes to the respective power semiconductor circuits, and partially enclosing the power semiconductor modules in a common housing, wherein the first and second contact electrodes of the two power semiconductor modules are each led through the common housing through a cut-out and where the common housing has first, second and third contacting regions, where the first and second contact electrodes of the first power semiconductor module contact together in the first contacting region, the first and second contact electrodes of the second power semiconductor module contact together in the second contacting region, the second contact electrode of the first power semiconductor module and the second contact electrode of the second power semiconductor module contact together in the third contacting region.