Power Module Contact Cooling for DC-Link Capacitor Heat Control

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Solution Overview

Problem

Existing power electronic arrangements for electric machines in motor vehicles fail to effectively cool intermediate circuit energy accumulators, leading to increased production costs, larger design volume, weight, and reduced service life due to thermal stress.

Innovation Solution

The connection contacts of the power module are arranged flat against a substrate carrying the power semiconductors and thermally coupled to a heat sink, allowing the intermediate circuit energy accumulator to be cooled through these contacts, eliminating the need for direct attachment to active cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the intermediate circuit energy accumulator is not connected to the active cooling system, then the cooling device structure remains simple, but the accumulator requires larger design volume and heavier weight to handle thermal stress

Engineering Contradiction:
Improvecooling device structureVSAvoidintermediate circuit energy accumulator volume
Core Design Contradiction:
Device complexityVSVolume of moving object

Solution Approach 1:

The patent merges the cooling function with the electrical connection structure by integrating the heat sink directly into the connection contacts of the power module. The connection contacts serve dual purposes: electrical connection to the intermediate circuit energy accumulator and thermal conduction path to dissipate heat. This eliminates the need for separate cooling connections while enabling active cooling of the accumulator through the existing electrical interface.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The connection contacts are designed to perform multiple functions simultaneously: electrical connection, thermal conduction, and structural support. By making the connection contacts thermally conductive and integrating them with the heat sink, the same component that provides electrical connectivity also serves as the cooling pathway, eliminating the need for additional dedicated cooling structures.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of manufacture

If the intermediate circuit energy accumulator is not actively cooled, then production costs remain lower, but the accumulator requires larger design volume and the power electronic arrangement becomes heavier

Engineering Contradiction:
Improveproduction costVSAvoidpower electronic arrangement weight
Core Design Contradiction:
Ease of manufactureVSWeight of stationary object

Solution Approach 1:

The cooling function is merged into the existing electrical connection system. The heat sink is integrated with the connection contacts, which are already part of the power module assembly. This approach enables active cooling without requiring separate cooling components or complex installation procedures, thus avoiding significant increases in production costs while achieving weight reduction through optimized accumulator sizing.

Inventive Principle:
Principle #5Merging (Combining)

3Device complexity

If the intermediate circuit energy accumulator is not actively cooled, then the cooling system remains simpler, but thermal stress reduces service life and causes premature derating

Engineering Contradiction:
Improvecooling system complexityVSAvoidintermediate circuit energy accumulator service life
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent combines the cooling function with the electrical connection system by integrating the heat sink into the connection contacts. This allows the intermediate circuit energy accumulator to be actively cooled through the same structure that provides electrical connectivity, eliminating the need for complex separate cooling systems while significantly improving reliability by reducing thermal stress and preventing premature derating.

Inventive Principle:
Principle #5Merging (Combining)

4Device complexity

If connection contacts are made thermally conductive and integrated with the heat sink, then the intermediate circuit energy accumulator can be cooled through existing contacts, but the connection contacts require optimized thermal and electrical design

Engineering Contradiction:
Improvecooling device structureVSAvoidconnection contacts design complexity
Core Design Contradiction:
Device complexityVSEase of manufacture

Solution Approach 1:

The patent merges the thermal conduction function with the electrical connection function in the connection contacts. The contacts are designed with optimized thermal and electrical properties, using materials and geometries that simultaneously satisfy both requirements. This integrated design approach enables cooling functionality without requiring separate components, though it does necessitate careful optimization of the connection contact design to balance thermal and electrical performance.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces production costs, design volume, and weight while increasing the service life by minimizing thermal stress and avoiding premature derating, with improved heat transfer through the use of metallization layers and direct attachment methods like laser welding.

Implementation Method 1

a heat sink, to which the at least one power module is thermally connected for cooling

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

active cooling fluid flow to dissipate heat effectively

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

the connection contacts are arranged at the margin and flat against a substrate carrying the power semiconductors or are formed from this, and they are thermally coupled to the heat sink via the substrate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12621968B2Power electronic arrangement for an electric machine and motor vehicle
Publication Date: 2026.05.05 AUDI AG
  • US12621968B2 patent drawing
  • US12621968B2 patent drawing

AI summary

A power electronic arrangement for an electric machine, includes an inverter, power electronic components accommodated in at least one power module, an intermediate circuit connected to the inverter across connection contacts of the at least one power module and having at least one intermediate circuit energy accumulator, and a heat sink to which the at least one power module is thermally connected for cooling, the connection contacts are arranged at a margin and flat against a substrate carrying one or more power semiconductors, and are thermally coupled to the heat sink via the substrate, wherein the at least one intermediate circuit energy accumulator is connected electrically and thermally to the connection contacts to cool the at least one intermediate circuit energy accumulator.