Power Module Base Plate Assembly With Inserted Cooling Fins
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Solution Overview
Problem
Existing power module units face challenges with complex manufacturing processes, high material interfaces, and inefficient heat transfer due to the need for multiple material boundaries between the base plate and heat sink, which are exacerbated by the energy-intensive heating of the entire heat sink to high temperatures.
Innovation Solution
A method where the substrate with the power semiconductor is directly attached to the base plate using a soldered connection, with cooling fins inserted into recesses in the base plate after the substrate is secured, allowing for a simplified and energy-efficient manufacturing process by heating only the base plate, and utilizing a trapezoidal recess design and form-fit connections to minimize stress on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate production and assembly processes are used for semiconductor chips and circuit boards, then manufacturing precision can be maintained, but production time increases and productivity decreases
Solution Approach 1:
The patent merges the semiconductor chip production process with the circuit board assembly process into a single integrated production line. The semiconductor chip is produced directly on the circuit board substrate in one continuous process, eliminating the need for separate production and assembly steps while maintaining manufacturing precision through controlled process parameters.
Solution Approach 2:
The circuit board substrate is prepared in advance with predetermined circuit patterns and functional areas before the semiconductor chip production begins. This preliminary preparation allows the chip fabrication processes to be performed directly on the pre-configured substrate, reducing subsequent assembly time and improving overall productivity.
2Reliability
If multiple production steps are used to produce semiconductor chip and circuit board separately, then manufacturing quality can be ensured, but production time increases
Solution Approach 1:
The patent combines multiple production steps into an integrated process where semiconductor chip fabrication and circuit board manufacturing are performed simultaneously in one production line. This merging maintains quality control through unified process management while significantly reducing the total production time by eliminating sequential processing delays.
Solution Approach 2:
The production process is designed as a continuous operation where materials and components move through various processing stages without interruption. The semiconductor chip production and circuit board assembly proceed continuously in an integrated flow, eliminating idle time between steps and maintaining high production efficiency while ensuring quality through consistent process conditions.
3Device complexity
If discrete components are assembled on circuit board, then device complexity is reduced, but connection reliability decreases due to mounting errors
Solution Approach 1:
The patent integrates the semiconductor chip and circuit board into a unified structure where the chip is produced directly on the board substrate. This merging eliminates the discrete assembly step that causes mounting errors, while the integrated design maintains manageable device complexity through standardized production processes and modular functional areas on the circuit board.
Data Source
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AI summary
The invention relates to a method for producing a power module unit (1) and a power module unit (1). The invention also relates to a network part and a frequency converter. In order to produce the power module unit (1), a base plate (3) is provided with recesses (9). The base plate is connected to a substrate (4) which supports the power semiconductor (5). After the securing of the substrate (4) on the base plate, the cooling ribs (7) are guided into the recesses (9) of the base plate (3) and interlockingly and/or force-lockingly secured. In this way a power module unit (1) can be formed as required with cooling ribs (7) and the production of the power module unit (1) is simplified at the same time.