Power Module Cooling System with Integrated Coolant Passageways

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Solution Overview

Problem

Existing cooling systems for power modules face challenges with thermal interface material consistency and high thermal resistance, as well as mechanical complexity in achieving effective heat dissipation, especially in compact automotive applications.

Innovation Solution

A cooling system design that forms a coolant passageway through overmolding, utilizing two covers and power modules with heat dissipation elements, where coolant flows through channels and spaces between modules, reducing external components and enhancing heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal interface material is used to transfer heat from power module to heat sink, then heat transfer is enabled, but thermal resistance is high and application consistency is difficult

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidthermal interface consistency
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent removes the thermal interface material layer entirely by integrating cooling channels directly into the power module housing structure. The housing is designed with built-in coolant passages that are molded as integral parts, eliminating the need for separate thermal interface materials and associated assembly steps.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The cooling function is merged with the housing structure by integrating coolant channels directly into the housing during the molding process. This combines the structural housing and thermal management functions into a single integrated component, eliminating the need for separate heat sinks and thermal interface materials.

Inventive Principle:
Principle #5Merging (Combining)

2Temperature

If indirect cooling with multiple heat sinks is implemented, then cooling coverage is improved, but mechanical complexity increases

Engineering Contradiction:
Improvecooling coverageVSAvoidassembly complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges multiple cooling functions into a single integrated housing structure with built-in coolant channels. Instead of using separate heat sinks and thermal interface materials, the housing itself contains the cooling passages, reducing the number of components and simplifying assembly.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The housing serves multiple functions simultaneously: it provides structural support, electrical insulation, and thermal management through integrated coolant channels. This multi-functionality eliminates the need for separate dedicated cooling components, reducing overall system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves heat dissipation efficiency by reducing thermal resistance and mechanical complexity, allowing for a more compact and reliable cooling system suitable for automotive power modules.

Implementation Method 1

coolant flows through channels and spaces between modules, reducing external components and enhancing heat dissipation efficiency

Methodology Applied
Scientific EffectHeat transfer: Convection

Implementation Method 2

heat dissipation efficiency by reducing thermal resistance

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3833171B1Cooling system for power modules
Publication Date: 2023.12.27 DELTA ELECTRONICS INC(CN)
  • EP3833171B1 patent drawingFigure 1
  • EP3833171B1 patent drawingFigure 2
  • EP3833171B1 patent drawingFigure 3

AI summary

A cooling system (1, 1a) for power modules is provided. The cooling system (1, 1a) includes two covers (11, 12), a plurality of power modules (21) and a plurality of first spaces (31). The power modules (21) are disposed between the two covers (11, 12). Each power module (21) includes a housing (22), a circuit board (23) and heat dissipation elements (24) disposed on the two sides of the circuit board (23). There is a through hole (25) on the housing (22). Each first space (31) is formed between two neighboring power modules (21) or is formed between the cover (11, 12) and the neighboring power module (21). The heat dissipation elements (24) of each power module (21) are located in the neighboring first spaces (31), and the through hole (25) of each power module (21) is in communication with the neighboring first spaces (31). The first spaces (31) and the through holes (25) of the power modules (21) are communicated with each other to form a coolant passageway collaboratively for allowing a coolant to pass through.