Power Module Cooling System With Overlapping Fins
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Solution Overview
Problem
Existing power module cooling systems are inefficient in thermal conductivity and require multiple cooling systems for each power module, leading to increased size and complexity in space-constrained applications.
Innovation Solution
A power module cooling system with a housing having a chamber defined by top and bottom portions and sides, featuring a first set of fins extending from the top portion and a second set of fins from the bottom portion, which overlap in orthogonal planes, creating three-dimensional swirling and tumbling of liquid coolant for enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a single cooling system is used to cool multiple power modules, then the overall system size is reduced, but the thermal conductivity efficiency decreases
Solution Approach 1:
The patent transitions from traditional two-dimensional fin arrangements to a three-dimensional configuration where fins extend in multiple directions and overlap in orthogonal planes. This dimensional enhancement allows the single cooling system to simultaneously cool multiple power modules while maintaining high thermal conductivity through increased coolant-flowing surface area and improved fluid dynamics.
Solution Approach 2:
The cooling system employs nested overlapping fin structures where first and second sets of fins interpenetrate in three-dimensional space. The fins from opposite ends of the chamber overlap in the middle region, creating a nested configuration that maximizes heat transfer surface area within a compact volume, enabling efficient cooling of multiple modules share a single cooling system.
2Temperature
If traditional two-dimensional fin arrangements are used, then manufacturing is simpler, but thermal conductivity is insufficient
Solution Approach 1:
The patent advances from planar two-dimensional fin layouts to three-dimensional configurations where fins extend from opposite ends and overlap in orthogonal planes. This spatial evolution creates complex overlapping patterns that significantly enhance thermal conductivity by increasing the coolant-flowing surface area and promoting three-dimensional swirling flow, while remaining manufacturable through systematic design.
3Temperature
If multiple separate cooling systems are used for each power module, then thermal cooling efficiency is maintained, but the system complexity and footprint increase
Solution Approach 1:
The patent merges multiple cooling functions into a single integrated cooling system. By configuring fins that extend from both top and bottom portions and overlap in the chamber, the system creates unified three-dimensional cooling channels that simultaneously serve multiple power modules, reducing the number of separate cooling systems needed while preserving cooling efficiency through enhanced thermal conductivity.
Solution Approach 2:
The single cooling system achieves multi-functionality by designing overlapping fin structures that can cool multiple power modules simultaneously. The three-dimensional fin configuration creates universal cooling channels that serve various modules within the same chamber, allowing one cooling system to perform the work of multiple separate systems while reducing overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves increased thermal conductivity and reduced pumping pressure drop, allowing for simultaneous cooling of multiple power modules with a single cooling system, thereby reducing overall size and complexity.
Implementation Method 1
the liquid coolant traverses the first set of fins and the second set of fins between the inlet and the outlet within the chamber
Implementation Method 2
structures to generate three-dimensional swirling and tumbling in liquid coolant flowing within a chamber of the cooling system
Data Source
AI summary
Embodiments of the present disclosure are directed to power module cooling systems. In particular, some embodiments of the present disclosure relate to power module cooling systems with structures to generate three-dimensional swirling and tumbling in liquid coolant flowing within a chamber of the cooling system. Other embodiments may be disclosed or claimed.