Power Module Cooling Unit Orthogonal Pipe Layout
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing power modules in electric vehicles face a challenge in maintaining a compact size, particularly in the lateral direction, due to the arrangement of the inverter, heat sink, and three-phase line, which can lead to increased size and potential thermal issues.
Innovation Solution
A power module design incorporating a semiconductor module with a resin-covered terminal and an integrated cooling device featuring a supply and discharge pipe configuration that is orthogonal to the semiconductor module's alignment, allowing for efficient heat management and compact size retention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the supply pipe and discharge pipe are arranged in the alignment direction of the semiconductor module and cooling unit, then the lateral size is reduced, but the thermal management efficiency deteriorates
Solution Approach 1:
The patent transitions the pipe arrangement from the alignment direction (lateral dimension) to the vertical direction, utilizing the third dimension (height) to resolve the spatial conflict. This allows the pipes to be positioned above or below the semiconductor module without increasing lateral footprint, while maintaining effective thermal contact through the cooling unit's heat dissipation structure.
Solution Approach 2:
The patent employs asymmetric positioning of the supply and discharge pipes in the vertical direction, with the supply pipe positioned at a different height than the discharge pipe. This asymmetric arrangement optimizes the refrigerant flow path and heat exchange efficiency while maintaining a compact lateral profile.
2Temperature
If the cooling unit is positioned closer to the semiconductor element, then heat dissipation efficiency is improved, but the lateral space requirement increases
Solution Approach 1:
The patent positions the cooling unit in the vertical direction relative to the semiconductor element rather than laterally. The cooling unit extends upward or downward from the semiconductor module, allowing close thermal coupling without increasing the lateral footprint of the power module.
3Temperature
If the refrigerant flow path is optimized for thermal efficiency, then temperature control is improved, but the device complexity increases
Solution Approach 1:
The patent integrates the supply and discharge pipes directly with the cooling unit's heat dissipation structure, merging the refrigerant flow path with the thermal management structure. This integration achieves effective temperature control while avoiding separate, complex piping systems.
Solution Approach 2:
The cooling unit serves multiple functions: it provides the refrigerant flow path for heat removal, acts as a structural support element, and facilitates thermal coupling between the semiconductor element and refrigerant. This multi-functionality reduces overall device complexity while maintaining temperature control efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the increase in size in the lateral direction, enhances thermal resistance, and reduces temperature rise by optimizing the placement and orientation of the cooling unit and refrigerant flow, ensuring efficient heat dissipation.
Implementation Method 1
a cooling unit provided in the semiconductor module so as to be capable of conducting heat
Data Source
AI summary
A power module has a semiconductor module and a cooling device. The cooling device has a cooling unit provided in the semiconductor module so as to be capable of conducting heat, a supply pipe configured to supply refrigerant to an interior of the cooling unit, and a discharge pipe configured to discharge the refrigerant that is flowed inside the cooling unit. The semiconductor module and the cooling unit are arranged in a z-direction. The supply pipe and the discharge pipe are spaced apart in a x-direction. Each of the supply pipe and the discharge pipe faces the semiconductor module in a y-direction.