Power Module Housing Molding With Local Cooling Seals
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Solution Overview
Problem
Existing methods for producing housings for power semiconductor module arrangements are elaborate and costly.
Innovation Solution
A mold with a first cavity, sleeves or hollow bushings, a heating element, and a cooling element is used to inject and harden mold material around terminal elements, sealing openings and forming a compact housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional methods are used to produce housings for power semiconductor module arrangements, then the housing can be produced with adequate structural integrity, but the production process becomes elaborate and costly
Solution Approach 1:
The patent combines multiple production steps into a single integrated molding process. The housing is produced by injecting mold material directly into a mold cavity that already contains the semiconductor substrate and terminal elements, eliminating separate assembly steps for mounting components and forming the housing enclosure.
Solution Approach 2:
The mold cavity serves multiple functions simultaneously: it holds the semiconductor substrate, positions the terminal elements, forms the housing enclosure, and creates sealing structures. This multi-functional approach simplifies the overall production process by consolidating what would traditionally require multiple specialized tools and steps.
2Productivity
If the mold material is cooled rapidly to harden it quickly, then productivity increases, but leakage may occur before the material fully hardens
Solution Approach 1:
The patent applies different thermal conditions to different regions of the mold cavity. The region near the terminal elements is cooled more aggressively to promote rapid hardening and sealing, while other regions maintain warmer temperatures to allow complete filling and prevent premature hardening that would cause defects.
Solution Approach 2:
The mold material is pre-heated before injection to ensure it remains fluid during the filling process, preventing premature hardening. Once the cavity is completely filled and sealed, cooling is then applied to harden the material and secure the sealing structure.
3Volume of moving object
If the housing is made compact to reduce size, then space efficiency improves, but access to terminal elements and assembly become more difficult
Solution Approach 1:
The terminal elements are integrated into the housing structure itself, with some elements forming part of the housing walls or protruding in a space-efficient manner. This nesting approach allows the housing to be compact while still providing necessary electrical connections without requiring additional external components or larger dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for the easy and cost-effective production of a housing for power semiconductor module arrangements by preventing mold material leakage and ensuring complete filling without voids.
Implementation Method 1
heating a mold material and pressing the mold material into the first cavity
Implementation Method 2
cooling the plurality of sleeves or hollow bushings by means of the cooling element, wherein the mold material hardens in the vicinity of the first ends
Implementation Method 3
the mold material hardens in the vicinity of the first ends of the plurality of sleeves or hollow bushings when it comes into contact with the respective first end
Data Source
Figure 1~2
Figure 3~4
Figure 5~6B
AI summary
A device for forming a housing for a power semiconductor module arrangement comprises a mold (80). The mold (80) comprises a first cavity (812) comprising a plurality of first openings (822) and a second opening (824), the second opening being coupled to a runner system (814), wherein the runner system (814) is configured to inject a mold material (90) into the first cavity (812) through the second opening (824). The device further comprises a plurality of sleeves or hollow bushings (82), wherein a first end (92) of each of the plurality of sleeves or hollow bushings (82) is arranged in one of the first openings (822), and wherein a second end of each of the plurality of sleeves or hollow bushings (82) extends to the outside of the mold (80), a heating element (84) configured to heat the mold (80), and a cooling element (86) configured to cool the plurality of sleeves or hollow bushings (82).