Power Module Interconnect Package Without Wire Bonding
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Solution Overview
Problem
Conventional power module packaging processes using wire bonding and silicone gel face reliability issues due to aging, leading to degradation in moisture and oxidation prevention, which reduces the interconnection reliability of lead wires.
Innovation Solution
An interconnect package is developed using multiple layers of insulating film and conductive traces, eliminating wire bonding, with conductive sheets and films forming source and gate connecting portions to securely attach source and gate pads to a substrate via sintering processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding and silicone gel are used for packaging, then the initial interconnection reliability is achieved, but the reliability degrades over time due to aging
Solution Approach 1:
The patent removes the wire bonding process and silicone gel encapsulation from the packaging structure. Instead, it uses direct bonding of conductive patterns on insulating layers to the substrate, eliminating the aging-prone materials while maintaining electrical connectivity and improving long-term reliability
Solution Approach 2:
The patent employs a composite structure consisting of multiple insulating layers with integrated conductive patterns (copper foil, conductive paste, or conductive mesh) bonded directly to the substrate. This composite approach replaces the traditional wire-gel system with a more stable material combination that resists aging
2Object-affected harmful factors
If filler material such as silicone gel is used, then moisture and oxidation prevention is provided initially, but the prevention capability degrades over time
Solution Approach 1:
The patent eliminates silicone gel and other filler materials from the packaging structure, replacing them with solid insulating layers that provide inherent moisture and oxidation barriers without the aging degradation associated with gel materials
Solution Approach 2:
The patent uses thin insulating film layers (insulating layer 22, 28) that provide continuous protective barriers against moisture and oxidation. These films maintain their protective properties over time without the degradation seen in gel-based encapsulants
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability of power modules by preventing wire defects and maintaining electrical connectivity, even under thermal stress, thus improving the overall performance and longevity of power devices.
Implementation Method 1
conductive traces not exposed from the plurality of gate openings are formed by depositing a conductive film on the first surface of the second insulating layer
Implementation Method 2
conductive sheets and films forming source and gate connecting portions to securely attach source and gate pads to a substrate via sintering processes
Data Source
Figure 1A~1C
Figure 2A~2C
Figure 3A~3C
AI summary
Embodiments of the present disclosure relate to an interconnect package, a method of forming the interconnect package, and a power module. The interconnect package can comprise a first insulating layer, a source connecting portion disposed on a surface of the first insulating layer and adapted to electrically connect a source pad to a substrate, a second insulating layer, and a gate connecting portion disposed between the first insulating layer and the second insulating layer and adapted to electrically connect a gate pad to the substrate. In addition, the second insulating layer has a plurality of gate openings and a plurality of source openings running therethrough and wherein a first surface of the second insulating layer is configured to attach to a surface of the first insulating layer such that a plurality of portions of the source connecting portion are exposed from the plurality of source openings on a second surface of the second insulating layer opposite the first surface, and such that a plurality of portions of the gate connecting portion are exposed from the plurality of gate openings on the second surface of the second insulating layer.