Power Module Microchannel Substrate for Compact Heat Dissipation
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Solution Overview
Problem
Current power modules in electrified vehicles face challenges in thermal management, leading to size constraints, reliability issues, and increased manufacturing costs due to inadequate cooling mechanisms.
Innovation Solution
A power module design featuring a substrate with a microchannel network that includes first and second microchannels configured to input and output coolant, respectively, with third microchannels crisscrossing to facilitate fluid communication, allowing for efficient coolant circulation and heat removal, thereby reducing module size and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling mechanisms are used in power modules, then the module can dissipate heat, but the module size increases and manufacturing costs increase
Solution Approach 1:
The patent transitions from conventional two-dimensional cooling channels to three-dimensional microchannels that extend vertically through the substrate thickness. This dimensional change enables significantly higher heat dissipation density within the same footprint, reducing the overall module volume while maintaining effective cooling.
Solution Approach 2:
The patent changes the physical parameters of the cooling system by reducing channel dimensions to the microscale (typically 10-1000 micrometers). This parameter change increases the surface-area-to-volume ratio, enhancing heat transfer efficiency and allowing compact module design without sacrificing cooling performance.
2Temperature
If conventional cooling mechanisms are used in power modules, then the module can dissipate heat, but manufacturing costs increase
Solution Approach 1:
The patent merges the cooling function with the substrate structure itself, integrating microchannels directly into the substrate during manufacturing. This consolidation eliminates the need for separate cooling plates, manifolds, and associated sealing components, thereby reducing part count, assembly steps, and manufacturing costs while achieving superior heat dissipation.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support for power devices, acts as an electrical insulator, and functions as a heat dissipation structure through integrated microchannels. This multi-functionality reduces the need for additional dedicated cooling components, simplifying manufacturing and reducing costs.
3Ease of manufacture
If inadequate cooling mechanisms are used, then manufacturing is simpler, but reliability issues occur due to thermal management problems
Solution Approach 1:
The substrate provides self-cooling through integrated microchannels that are formed as part of the substrate structure itself. The cooling function is embedded within the substrate, eliminating the need for separate cooling systems and reducing assembly complexity while ensuring reliable thermal management through direct heat conduction from power devices to the coolant flow paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The microchannel cooling arrangement enhances heat removal efficiency, reduces module size, and simplifies manufacturing and assembly, addressing thermal management challenges and improving power density.
Implementation Method 1
The substrate includes first microchannels configured to input coolant from the supply manifold and impeded from outputting coolant to the return manifold, second microchannels configured to output coolant to the return manifold and impeded from inputting coolant from the supply manifold
Implementation Method 2
third microchannels crisscrossing and connecting the first and second microchannels in fluid communication
Implementation Method 3
The microchannel cooling arrangement enhances heat removal efficiency, reduces module size, and simplifies manufacturing and assembly
Data Source
AI summary
A power module, such as a power module of a traction powertrain of an electrified vehicle, includes a power module cell arranged in a stack that defines a coolant supply manifold and a coolant return manifold. The power module cell includes a power stage having a substrate. The substrate includes first microchannels configured to input coolant from the supply manifold and impeded from outputting coolant to the return manifold, second microchannels configured to output coolant to the return manifold and impeded from inputting coolant from the supply manifold, and third microchannels crisscrossing and connecting the first and second microchannels in fluid communication.