Vehicle Power Module Cooling with Segmented Heatsinks
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Solution Overview
Problem
The cooling capabilities of power module assemblies in vehicles are limited, leading to heat accumulation and reduced throughput, and existing designs face challenges with high thermal conductivity materials causing electrical conductivity issues and requiring precise assembly processes.
Innovation Solution
A power module assembly design featuring a plurality of alternating heatsinks and phase legs with a dielectric layer for thermal insulation, and U-shaped coolant channels with dividers and obstructions to enhance heat transfer and coolant flow, allowing for collective curing and cost-effective assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high thermal conductivity materials are used for heatsinks, then heat dissipation capability is improved, but electrical conductivity increases causing insulation issues
Solution Approach 1:
The heatsink structure is segmented into multiple alternating heatsinks and phase legs arranged in a deck configuration. This segmentation allows each heatsink to be electrically isolated while maintaining thermal effectiveness through the distributed arrangement and dielectric layering.
Solution Approach 2:
A dielectric layer is introduced as an intermediary between the semiconductor switch and the heatsink. This dielectric layer provides electrical insulation while allowing thermal energy to pass through, resolving the contradiction between electrical insulation requirements and heat dissipation needs.
2Temperature
If complex cooling structures are implemented, then cooling capability is improved, but manufacturing precision requirements increase
Solution Approach 1:
Multiple heatsinks and phase legs are merged into a single deck assembly that is collectively cured. This merging of assembly operations reduces the number of separate precision alignment steps required, as the entire assembly is cured together rather than requiring sequential precision assembly of individual components.
Solution Approach 2:
The dielectric layers are pre-positioned between the switches and heatsinks before the collective curing process. This preliminary action ensures proper electrical insulation and thermal contact are established before the final assembly cure, simplifying the manufacturing process while maintaining precision requirements.
3Temperature
If coolant channels are added to heatsinks, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The heatsinks serve multiple functions: they provide structural support for the phase legs, act as thermal management components with integrated coolant channels, and maintain electrical isolation through the dielectric layers. This multi-functionality reduces the need for separate components, offsetting the added complexity with functional consolidation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat from semiconductor switches, reducing thermal limitations and enabling efficient cooling while maintaining electrical insulation and cost-effectiveness.
Implementation Method 1
heat generated by the switch is transferred to the heatsink via the dielectric
Implementation Method 2
The coolant channel may have inlet and outlet regions
Data Source
AI summary
A vehicle power system may include a power module assembly having a plurality of alternating heatsinks and phase legs arranged in a deck. Each of the phase legs includes a semiconductor switch in contact with a dielectric layer. The dielectric layer is sandwiched between the switch and one of the heatsinks such that heat generated by the switch is transferred to the heatsink via the dielectric. At least one of the heatsinks may define a coolant channel. The coolant channel may be U-shaped. The coolant channel may have inlet and outlet regions. The inlet region may be opposite the outlet region. The coolant channel may have a divider to segregate ingress and egress coolant paths. The coolant channel may have obstructions to form a tortuous path. The obstructions may be wavy fins.