Double-Sided Cooling Power Module Separation Plate Design
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Solution Overview
Problem
Conventional power modules with double-sided cooling face high costs due to expensive materials for thermal expansion management and complex manufacturing processes, and are prone to thermal stress issues.
Innovation Solution
A power module design that eliminates the spacer by using a separation plate with conductive layers and through-holes to connect leads and the semiconductor chip, made from a dielectric or ceramic material, simplifying the assembly process and reducing thermal expansion differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an expensive material such as aluminum-silicon carbide or copper-molybdenum is used for the spacer to minimize thermal expansion differences, then thermal stress is reduced, but the manufacturing cost increases
Solution Approach 1:
The patent replaces expensive spacer materials (aluminum-silicon carbide, copper-molybdenum) with a cheaper copper material that has sufficient durability for the application. The copper spacer achieves acceptable thermal stress resistance without requiring the costly advanced materials, thereby reducing manufacturing cost while maintaining functional reliability.
Solution Approach 2:
The patent changes the material parameter of the spacer from expensive alloys (Al-SiC, Cu-Mo) to standard copper, and compensates for thermal expansion differences through design parameters such as spacer geometry and bonding structure rather than relying solely on material composition, thus achieving cost reduction without complete loss of thermal stress resistance.
2Ease of manufacture
If copper is used for the spacer to reduce cost, then manufacturing cost decreases, but thermal expansion rate difference with the semiconductor chip increases causing decreased durability
Solution Approach 1:
The patent introduces a bonding structure as an intermediary element between the copper spacer and the semiconductor chip. This bonding layer acts as a transition that accommodates the thermal expansion difference between copper and the semiconductor chip, preventing direct stress transmission and maintaining durability despite using low-cost copper material.
Solution Approach 2:
The patent creates a composite structure combining copper spacer with a bonding material layer. This composite approach allows the copper to provide cost benefits while the bonding material compensates for thermal expansion mismatches, achieving a balance between cost and durability through material combination rather than relying on a single expensive material.
3Reliability
If a conventional three-step soldering and bonding process is used to attach the semiconductor chip to leads, then reliable connections are achieved, but manufacturing complexity and time increase
Solution Approach 1:
The patent merges the previously separate soldering and bonding processes into a single integrated soldering step. The spacer is designed to be directly soldered to the semiconductor chip and leads simultaneously, eliminating the intermediate bonding process and reducing manufacturing steps from three to two, thereby improving productivity while maintaining connection reliability through proper solder joint design.
Solution Approach 2:
The patent extracts and eliminates the redundant bonding process from the manufacturing sequence. By redesigning the spacer and lead structure to allow direct soldering connections, the separate bonding step is removed entirely, simplifying the manufacturing process and increasing production efficiency without compromising the reliability of electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces costs, minimizes thermal stress, and simplifies the manufacturing process, resulting in a more durable and cost-effective power module with improved thermal durability and production efficiency.
Implementation Method 1
An inner circumferential surface of the second hole provided in the separation plate may be provided with a conductive layer made of a conductive material. The conductive layer may be a copper plating layer.
Implementation Method 2
A lower portion of the second hole provided in the separation plate may be filled with a solder material to connect the conductive layer with the semiconductor chip.
Implementation Method 3
The first hole provided in the separation plate may be filled with a solder material to connect the first and second power leads with the semiconductor chip.
Data Source
AI summary
Disclosed is a power module with double-sided cooling, comprising a semiconductor chip disposed between an upper substrate and a lower substrate; a first power lead disposed between the upper substrate and the semiconductor chip; a signal lead disposed between the upper substrate and the semiconductor chip, and spaced apart from the first power lead; a second power lead disposed between the lower substrate and the semiconductor chip; and a separation plate disposed between the first power lead, the signal lead, and the semiconductor chip; wherein the separation plate connects the first power lead with the semiconductor chip via a first hole formed through the separation plate, and connects the signal lead and the semiconductor chip via a second hole formed through the separation plate.