Semiconductor Power Module Socket Sealing During Molding

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Solution Overview

Problem

Existing semiconductor power modules face challenges in manufacturing, particularly with protruding contact pins, as sealing elements must be attached before attachment to the substrate, leading to complex and costly processes, and molding compound overflow, resulting in contamination and increased costs.

Innovation Solution

A semiconductor power module design featuring a socket with a socket base and a sealing ring that is elastically deformed during molding to seal against the socket shank, preventing molding compound penetration, using standardized components and flexible manufacturing processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If sealing elements are attached to contact pins before attaching to substrate, then sealing function is ensured, but manufacturing complexity and cost increase

Engineering Contradiction:

Improvesealing functionVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The sealing ring is pre-mounted on the contact pin in an uncompressed state before the molding process. This preliminary action ensures the sealing element is in position to perform its sealing function while avoiding the need for complex post-attachment sealing operations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The sealing ring transitions from an uncompressed state during assembly to a compressed state during molding. This parameter change allows the same sealing ring to provide effective sealing without requiring complex attachment processes, as the compression occurs naturally during the molding process.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If sealing elements are attached before molding, then sealing is provided, but molding compound overflows and contaminates contact pins

Engineering Contradiction:

Improvesealing functionVSAvoidmolding compound contamination

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The sealing ring is pre-installed on the contact pin to create a sealing barrier before the molding compound is injected. This preliminary anti-action prevents the molding compound from reaching and contaminating the contact pin during the molding process.

Inventive Principle:

Principle #9Preliminary anti-action

Solution Approach 2:

The sealing ring is designed to be compressed during molding, changing its dimensional parameters to provide effective sealing. The compression occurs in the direction away from the contact pin, ensuring the sealing action prevents molding compound contamination while allowing the contact pin to protrude freely.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If specific contact pins and mold dies are provided for each configuration, then sealing reliability is improved, but manufacturing flexibility and cost are reduced

Engineering Contradiction:

Improvesealing reliabilityVSAvoidmanufacturing flexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The sealing ring is designed as a universal component that can be used with different contact pin configurations and mold dies. The standardized sealing ring provides reliable sealing across multiple applications, eliminating the need for custom-designed contact pins and mold dies for each configuration.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The sealing ring is pre-mounted on contact pins in a standardized manner before the molding process. This preliminary, standardized assembly approach allows the same mold die to be used for different contact pin configurations, significantly improving manufacturing flexibility while maintaining sealing reliability.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design ensures a tight seal without molding compound contamination, reduces manufacturing complexity and costs, and allows for flexible and robust production of semiconductor power modules with high reproducibility.

Implementation Method 1

at least one sealing ring (5) arranged around the socket shank (62) and configured to seal the socket shank (62) against entrance of molding material (10) into the hollow space (63) during the molding step of the casing (15)

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS20260068749A1Semiconductor power module and method for manufacturing a semiconductor module

Publication Date: 2026.03.05 SEMIKRON DANFOSS GMBH

AI summary

Semiconductor power module includes one or more semiconductors placed on a substrate having a conductive layer, a casing made of molding material encapsulating at least the substrate and the semiconductor, at least one socket with a socket base mounted on the substrate and configured for receiving and holding a pin connector in a basically upright position perpendicular to the substrate by means of a hollow space in the socket shank defining the upright direction, at least one sealing ring arranged around the socket shank and resting on the socket base. The sealing ring is fixedly hold in an elastically deformed state in the upright direction against the socket base by the molding material and seals the socket shank against entrance of molding material into the hollow space during the molding step of the casing such that the hollow space provides for an opening on the outside surface of the casing.