Power Module Package Thickness Uniformity via Spacer Recess
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Solution Overview
Problem
Power module packages face issues with non-uniform thickness due to varying process conditions, leading to degradation of quality and reduced product lifespan, and require improved thermal management for efficient heat dissipation.
Innovation Solution
A power module package design featuring a lower and upper substrate with spacers and adhesive layers to maintain constant thickness, supported by a ribbon for thermal conductivity, and a method involving soldering and bonding for assembly, allowing for adjustable compression to stabilize thickness and enhance thermal reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a power module package is assembled using conventional processes, then the package can be manufactured, but the thickness becomes non-uniform leading to quality degradation and reduced product lifespan
Solution Approach 1:
The spacer is pre-formed with a recess portion before assembly, which is designed to receive and accommodate the power semiconductor element. This preliminary structuring ensures that when the element is placed in the recess, the upper substrate can be attached at a precise position, guaranteeing uniform package thickness and preventing quality degradation while extending product lifespan.
2Manufacturing precision
If the package thickness is not uniformly maintained, then manufacturing can proceed, but quality degradation occurs and process stability decreases
Solution Approach 1:
The spacer structure with the recess portion automatically positions the power semiconductor element during assembly. The element nestles into the recess, which self-aligns and self-positions the component, eliminating the need for complex external positioning mechanisms. This self-positioning feature ensures consistent package thickness and maintains process stability, thereby improving both manufacturing precision and productivity.
3Temperature
If thermal management is not optimized, then the package structure can be simplified, but heat dissipation efficiency decreases
Solution Approach 1:
The spacer serves multiple functions simultaneously: it maintains the predetermined distance between substrates to ensure uniform thickness, provides a recess for precise element positioning, and facilitates optimal thermal management. By integrating these functions into a single component, the design achieves efficient heat dissipation without significantly increasing package structure complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains consistent package thickness, prevents quality degradation, and improves process stability and productivity by addressing thickness non-uniformity and enhancing thermal management for efficient heat dissipation.
Implementation Method 1
a first spacer (250) attached to an upper portion of the power semiconductor element (230) via a first adhesive layer (264), a second spacer (255) attached to an upper portion of the ribbon (280) via a second adhesive layer (266)
Implementation Method 2
an upper substrate (220) attached to an upper portion of each of the first and second spacers (250, 255) via a third adhesive layer (265)
Implementation Method 3
The power semiconductor element may be mounted on the lower substrate through soldering
Implementation Method 4
the ribbon may be mounted on the lower substrate through bonding
Implementation Method 5
supported by a ribbon for thermal conductivity, and a method involving soldering and bonding for assembly, allowing for adjustable compression to stabilize thickness and enhance thermal reliability
Data Source
AI summary
Disclosed relates to a power module package and a method for manufacturing the same. The power module package includes a lower substrate on which a pattern is formed, a power semiconductor element and a ribbon which are separated apart from each other at a predetermined distance to be mounted on an upper surface of the lower substrate, a first spacer attached to an upper portion of the power semiconductor element via a first adhesive layer, a second spacer attached to an upper portion of the ribbon via a second adhesive layer, and an upper substrate attached to an upper portion of each of the first and second spacers via a third adhesive layer.