Power Module Substrate Thickness Compensation via Pressure
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Solution Overview
Problem
Conventional power modules with two substrates often exhibit high variations in thickness due to manufacturing processes, leading to inconsistencies in the total module thickness, which complicates handling and mounting in larger devices.
Innovation Solution
The implementation of a compensation layer between the two substrates, which can be reduced in thickness through an abrasive-free process, such as pressure application, to compensate for thickness variations and ensure a predefined module thickness, thereby eliminating the need for additional polishing or grinding steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional substrates with high thickness variation are used, then substrate manufacturing is simpler, but the total module thickness varies significantly
Solution Approach 1:
A compensation layer is disposed between the first and second substrates before final assembly to pre-compensate for thickness variations. This preliminary action allows thickness adjustment to occur before the substrates are permanently joined, enabling better control of the total module thickness without requiring post-assembly adjustments or more precise substrate manufacturing
Solution Approach 2:
The compensation layer's thickness is adjusted (reduced from first thickness to second thickness) through pressure application during or after assembly. This parameter change allows the compensation layer to adapt to actual thickness variations in the substrates, ensuring the total module thickness meets specifications even when substrate thicknesses vary within their tolerances
2Manufacturing precision
If polishing or grinding processes are used to reduce compensation layer thickness, then module thickness precision is improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent replaces traditional mechanical abrasive processes (polishing or grinding) with a pressure-based thickness reduction method. By applying pressure to the compensation layer, the thickness is reduced from the first thickness to the second thickness without requiring abrasive tools, thereby eliminating the time-consuming polishing or grinding steps while achieving the necessary thickness precision
Solution Approach 2:
The patent extracts or removes the need for polishing or grinding processes entirely by using a compensation layer that can be thickness-adjusted through pressure application. This extraction of unnecessary process steps simplifies the manufacturing flow and reduces cycle time while maintaining or improving thickness precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy and manufacturing yield of power modules by effectively compensating for substrate thickness tolerances, reducing the complexity of the manufacturing process and ensuring consistent outer dimensions.
Implementation Method 1
reducing the thickness of the compensation layer from the first thickness to a second thickness by pressure
Data Source
AI summary
A method of manufacturing a power module comprising two substrates is provided, wherein the method comprises disposing a compensation layer of a first thickness above a first substrate; disposing a second substrate above the compensation layer; and reducing the thickness of the compensation layer from the first thickness to a second thickness after the second substrate is disposed on the compensation layer.