Power Module Wire Cooling With Graphite Thermal Sheet
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Solution Overview
Problem
The increasing temperature of wire distributions in power modules due to higher currents or downsizing reduces the lifetime of semiconductor chips and wire bonding joints, and can cause the wire distribution to melt and disconnect.
Innovation Solution
A power module design that includes a base plate, an insulating substrate with circuit patterns, semiconductor chips, metal wires, and a thermal conductive sheet with a graphite sheet contacting the metal wires, allowing heat from one wire to be transmitted to another and radiated to the circuit pattern, thereby reducing temperature increases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If current is increased or power module is downsized, then power density is improved, but temperature of wire distribution increases
Solution Approach 1:
A thermal conductive sheet is introduced as an intermediary component between the metal wires and the heat dissipation path. This sheet facilitates heat transfer from the wires to the surrounding structures, effectively mediating the thermal management in the power module
Solution Approach 2:
Heat is extracted from the wire distribution by introducing the thermal conductive sheet that provides a dedicated heat dissipation path, separating the thermal management function from the electrical connection function
2Reliability
If temperature of wire distribution increases, then heat radiation property deteriorates, but lifetime of semiconductor chip and wire bonding joint is reduced
Solution Approach 1:
The thermal conductive sheet acts as a mediator that provides an additional heat dissipation path, reducing the thermal load on wire bonding joints and thereby extending their operational lifetime
Solution Approach 2:
The metal wires serve dual functions: electrical connection and heat dissipation. By utilizing the wires themselves as heat dissipation paths in conjunction with the thermal conductive sheet, the system achieves self-service thermal management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively improves the heat radiation properties of metal wires on semiconductor chips, preventing temperature increases and extending the lifetime of the semiconductor chip and wire bonding joints by efficiently radiating heat from the wires.
Implementation Method 1
heat of the second metal wire is transmitted to the first metal wire via the graphite sheet
Implementation Method 2
radiate the heat from the first metal wire to the circuit pattern
Data Source
AI summary
It is an object of the present invention to improve a heat radiation property of a metal wire on a semiconductor chip in a power module. A power module includes: a plurality of metal wires connected to a surface of at least one semiconductor chip; and a thermal conductive sheet having contact with the metal wire. The metal wire includes: at least one first metal wire connecting a surface of the semiconductor chip and a circuit pattern and at least one second metal wire connecting two points on the surface of the semiconductor chip and having the same potential as the first metal wire. The thermal conductive sheet includes a graphite sheet, and a sheet surface of the thermal conductive sheet has contact with the at least one first metal wire and the at least one second metal wire.