Power Semiconductor Package With Separate Boot and Switch Terminals
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Solution Overview
Problem
Modern electronic devices require high-efficiency, high-power-density power converters that can operate at lower voltages and higher switching frequencies, but existing solutions like DrMOS-type power semiconductor packages are limited in versatility and utility due to their single switch terminal and lack of separate boot terminals, making them unsuitable for advanced configurations such as multi-level and series-capacitor buck converters.
Innovation Solution
The development of a power semiconductor package with separate terminals for high-side and low-side switches, multiple boot terminals, and integrated level shifter circuitry allows for more advanced power converter configurations, enabling higher power transfer and efficiency at lower voltages and higher switching frequencies, and facilitating modular and scalable designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If DrMOS-type power semiconductor packages with single switch terminal are used, then device complexity is reduced, but adaptability or versatility deteriorates
Solution Approach 1:
The patent segments the previously unified switch terminal into separate high-side switch terminal and low-side switch terminal. This segmentation allows the power semiconductor package to be configured in different converter topologies (buck, boost, flyback, etc.) while maintaining a relatively simple internal structure, thus resolving the contradiction between simplicity and versatility.
Solution Approach 2:
The power semiconductor package is designed with universal terminals that can function in multiple converter configurations. The separate high-side and low-side switch terminals, combined with boot terminals and control terminals, enable the same package to be used across various converter types, achieving multi-functionality without proportionally increasing complexity.
2Adaptability or versatility
If separate boot terminals are added, then adaptability or versatility is improved, but device complexity increases
Solution Approach 1:
The boot terminal functionality is segmented from the main power terminals. By providing dedicated boot terminals (first boot terminal and second boot terminal) that are electrically isolated from the high-side and low-side switch terminals, the package achieves better converter compatibility while keeping the terminal structure organized and manageable.
3Adaptability or versatility
If multiple separate terminals are implemented, then adaptability or versatility is improved, but ease of manufacture deteriorates
Solution Approach 1:
The patent combines multiple functional elements into a single integrated power semiconductor package. The high-side switch, low-side switch, boot circuitry, and control logic are merged into one package with standardized terminals, which simplifies the overall manufacturing process compared to assembling multiple discrete components, while still providing the versatility of separate terminals for different converter configurations.
Data Source
AI summary
Subject matter disclosed herein may relate to semiconductor devices, and may more particularly relate to power semiconductor packages, for example.