Integrated Power PCB-Cold Plate Assembly for Thermal Management
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Solution Overview
Problem
The manufacture of multi-layer printed circuit boards (PCBs) is challenging due to design and manufacturing complexities, particularly in integrating power devices and ensuring effective thermal management.
Innovation Solution
The integration of power electronics embedded PCBs with cold plates, utilizing a bonding interface such as a LTR, CVD, or ceramic sintered layer for thermal communication, and incorporating fluid-cooled cold plates for temperature regulation, along with 3D printing techniques for dielectric and conductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multi-layer PCBs are used to increase component density, then the capacity and density of electronic components improve, but the design and manufacturing difficulty increases
Solution Approach 1:
The patent combines the PCB substrate, power devices, and cold plate into a single integrated assembly. The power devices are mounted directly on the PCB and thermally coupled to the cold plate, eliminating the need for separate manufacturing and assembly steps for these components. This merging approach maintains high component density while simplifying the overall manufacturing process by reducing the number of discrete layers and assembly operations required.
Solution Approach 2:
The cold plate serves multiple functions simultaneously: it acts as a thermal management system for cooling power devices, provides structural support for the PCB assembly, and serves as a mounting platform for power devices. This multi-functionality reduces the need for additional dedicated components and layers, thereby maintaining component density while reducing manufacturing complexity.
2Temperature
If power devices are integrated into PCBs, then thermal management efficiency improves, but manufacturing difficulty increases
Solution Approach 1:
The cold plate is pre-integrated with the PCB substrate before power devices are mounted. Thermal vias and conductive pathways are pre-established in the PCB layers during substrate fabrication. This preliminary preparation simplifies subsequent power device installation and ensures optimal thermal coupling without requiring complex post-assembly thermal management operations.
Solution Approach 2:
The patent embeds thermal management functionality within the PCB structure itself. Thermal vias are nested within the PCB layers, connecting the cold plate to internal power device mounting areas. This nesting approach integrates thermal management into the PCB fabric rather than adding it as a separate external system, improving thermal efficiency while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient thermal management of power devices, maintaining them below predefined temperatures, and facilitates the production of highly integrated PCBs with improved electrical insulation and thermal conduction properties.
Implementation Method 1
an integrated power electronics embedded PCB attached to and in thermal communication with a cold plate
Implementation Method 2
utilizing a bonding interface such as a LTR, CVD, or ceramic sintered layer for thermal communication
Data Source
AI summary
A method for high volume manufacture of highly integrated power electronics embedded printed circuit board (PCB)—cold plate assemblies or units includes assembling an integrated power electronics embedded PCB fabrication panel onto a cold plate fabrication panel and forming an integrated power electronics embedded PCB—cold plate fabrication panel. The integrated power electronics embedded PCB—cold plate fabrication panel is cut into a plurality of highly integrated power electronics embedded PCB—cold plate assemblies such that the plurality of highly integrated power electronics embedded PCB—cold plate assemblies individually include an integrated power electronics embedded PCB attached to and in thermal communication with a cold plate. Also, the cold plate can include a fluid chamber configured for a cooling fluid to flow therethrough.