Heat-Sinked Power Semiconductor Array With Angled Fins for Heat Rejection
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Solution Overview
Problem
Existing heat-sinked power semiconductors in motor assemblies do not effectively reject heat at a high enough rate.
Innovation Solution
An array of heat-sinked power semiconductors is designed with a power semiconductor and a heat sink, where the heat sink has a base and fins oriented non-parallel to the base, allowing for improved heat dissipation through coolant flow channels between adjacent fins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional heat sink configurations are used with parallel fins, then the structure is simple and easy to manufacture, but the heat rejection rate is insufficient
Solution Approach 1:
The patent applies asymmetry by configuring fins at non-parallel angles to the base surface. Specifically, fins are arranged with different angles relative to the base, creating asymmetric flow channels that optimize coolant flow distribution and thermal dissipation efficiency, thereby increasing the heat rejection rate while maintaining manufacturing feasibility
Solution Approach 2:
The patent transitions from conventional parallel fin arrangement to a multi-dimensional fin configuration where fins extend at various angles from the base. This dimensional change creates three-dimensional flow channels that enhance coolant circulation and thermal contact area, significantly improving heat rejection capability
2Loss of energy
If fins are oriented non-parallel to the base, then the heat rejection rate increases, but the manufacturing complexity increases
Solution Approach 1:
The heat sink is segmented into multiple fin sections, each with specific angular orientations. This segmentation allows the complex non-parallel fin structure to be broken down into manageable manufacturing units, where each section can be formed independently and then assembled, reducing overall manufacturing complexity while maintaining the thermal performance benefits of non-parallel fin configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat rejection capabilities by optimizing coolant flow paths, thereby improving thermal management in power semiconductors.
Implementation Method 1
The heat sink can be formed of a suitable material, such as copper, and is coupled to the plate terminal... A suitable fluid is circulated through the inverter and passes through fins on the heat sink to cool the heat-sinked power semiconductors
Implementation Method 2
A suitable fluid is circulated through the inverter and passes through fins on the heat sink to cool the heat-sinked power semiconductors during the operation of the motor assembly
Data Source
AI summary
An array of heat-sinked power semiconductors that includes a power semiconductor and a heat sink. The power semiconductor has a power semiconductor die, a plurality of first terminals and a second terminal. The power semiconductor die has a plurality of semiconductor terminals. Each of the first terminals is electrically coupled to an associated one of the semiconductor terminals. The second terminal is a surface mount terminal and is electrically coupled to one of the first terminals. The heat sink has a heat sink body and a plurality of fins. The heat sink body has a base and an exterior surface. The base is fixedly coupled directly to the surface mount terminal. The exterior surface has a fin mount portion to which the fins extend. At least a portion of the fin-mount portion is oriented non-parallel to base.