Power Semiconductor Module with Staggered IGBTs for Thermal Management
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Solution Overview
Problem
Current power semiconductor modules for electric vehicles and hybrid cars are large in size and have high thermal resistance, which hinders downsizing and cooling efficiency, and the vibration of current and voltage in switching elements makes stable motor driving difficult.
Innovation Solution
A power semiconductor module design featuring semiconductor elements interposed between shared DC and AC electrode conductors, with staggered IGBT arrangements to reduce heat interference and separate emitter sense terminals to prevent voltage oscillation, enhancing cooling efficiency and reducing module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple power semiconductor modules are used for two-motor hybrid system, then the power converter can drive two motors, but the footprint becomes large and downsizing is hindered
Solution Approach 1:
The patent combines two independent power semiconductor modules into a single integrated module. The first and second IGBTs with their respective diodes are housed in one module package, sharing common structural components such as the insulating substrate, conductor patterns, and sealing structure. This merging reduces the total footprint while maintaining the capability to drive two motors independently through the separate IGBT/diode pairs.
Solution Approach 2:
The integrated power semiconductor module performs multiple functions within a single package. It can independently control two motor phases through the first and second IGBTs, provide freewheeling paths through the diodes, and handle both motor circuits simultaneously. The module structure is designed to support dual-function operation while occupying the space of only one traditional module.
2Volume of stationary object
If IGBTs are arranged to face each other with third conductor interposed, then the module structure is compact, but heat components interfere and thermal resistance increases
Solution Approach 1:
The patent employs asymmetric thermal management by providing separate heat radiation structures for the first and second IGBTs. The first heat radiation structure is thermally coupled to the first IGBT, and the second heat radiation structure is thermally coupled to the second IGBT, rather than using a shared symmetric heat sink. This asymmetric arrangement allows independent heat dissipation paths that prevent thermal interference between the facing IGBTs while maintaining compact module dimensions.
Solution Approach 2:
The heat radiation system is segmented into separate structures for each IGBT. Instead of a single unified heat sink, the patent divides the thermal management system into distinct first and second heat radiation structures, each dedicated to a specific IGBT. This segmentation prevents heat accumulation and thermal interference in the conductor regions while maintaining overall module compactness.
3Use of energy by moving object
If emitter sense terminal is positioned near emitter electrode surface, then inductance is reduced, but current and voltage vibration occurs making stable motor driving difficult
Solution Approach 1:
The patent introduces an intermediate conductor pattern on the insulating substrate that serves as a mediator between the emitter electrode surface and the emitter sense terminal. The sense terminal is connected to the emitter through this intermediate conductor path rather than being positioned directly adjacent to the emitter electrode. This intermediate connection reduces the inductance while providing sufficient separation to prevent voltage oscillation and current vibration, ensuring stable motor driving.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a 23% reduction in module size, 60% decrease in thermal resistance, and improved cooling efficiency, while preventing voltage oscillation for stable operation.
Implementation Method 1
a radiator including a joint surface joined to these conductors
Data Source
AI summary
A power semiconductor module includes semiconductor elements of a first system constituting each of arms in a circuit of the first system, semiconductor elements of a second system constituting each of arms in a circuit of the second system, a plurality of DC electrode conductors including a common DC electrode conductor joined to the semiconductor elements of the first and second systems, and a plurality of AC electrode conductors joined to the respective semiconductor elements of the first and second systems. Each of the semiconductor elements of the first and second systems is interposed between the DC electrode conductor and AC electrode conductor.