Power Semiconductor Package Conductive Assembly Thermal Dissipation
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Solution Overview
Problem
Existing power semiconductor device packages face limitations in thermal dissipation and electrical connectivity, with high parasitic capacitances and inductances due to packaging materials and techniques, and require improved methods for connecting semiconductor devices to external mounting surfaces while maintaining reduced form factor and cost-effective fabrication.
Innovation Solution
A conductive assembly with a connecting structure is used to provide electrical and thermal connectivity between semiconductor device terminals and external mounting surfaces, featuring apertures and plate portions to accommodate semiconductor dies, allowing direct connection and enhanced heat dissipation, and including various shapes and configurations for improved reliability and solderability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging materials and techniques are used, then structural support and protection are provided, but parasitic capacitances and inductances increase and thermal dissipation is reduced
Solution Approach 1:
The patent removes traditional packaging materials such as encapsulants, molds, and lead frames that generate parasitic effects. The semiconductor die is exposed without conventional packaging, extracting only the essential conductive assembly for electrical connection and thermal management, thereby eliminating harmful parasitic capacitances and inductances.
Solution Approach 2:
The patent changes the electrical parameters of the packaging system by using a conductive assembly with specific geometric configurations (plate portions, connecting structures, apertures) that minimize parasitic inductance and capacitance. The conductive material properties and structural dimensions are optimized to achieve lower parasitic values compared to traditional packaging.
2Temperature
If conventional packaging structures are used, then protection is provided, but thermal dissipation is reduced and power density is limited
Solution Approach 1:
The patent removes traditional thermal management structures such as heat sinks and thermal interface materials that are separated from the die. Instead, the conductive assembly directly contacts the die, extracting unnecessary thermal resistance layers and providing superior thermal dissipation path for higher power density.
Solution Approach 2:
The conductive assembly serves multiple functions simultaneously: it provides electrical connection, thermal dissipation, and mechanical support. This multi-functionality eliminates the need for separate packaging materials and structures, enabling efficient heat removal and higher power density while maintaining structural integrity.
3Reliability
If wire bonding is used for electrical connection, then connectivity is achieved, but parasitic effects increase and fabrication complexity increases
Solution Approach 1:
The patent merges the electrical connection function into the conductive assembly structure itself, eliminating the need for separate wire bonding or soldering processes. The connecting structures are integrated directly with the semiconductor die during fabrication, combining multiple functions into a single component and simplifying the overall fabrication process.
Solution Approach 2:
The conductive assembly and its connecting structures are fabricated and positioned in advance during the semiconductor manufacturing process, before final assembly. This preliminary integration of electrical connection structures eliminates subsequent bonding steps and reduces fabrication complexity.
4Temperature
If exposed top and bottom surfaces are provided for thermal dissipation, then thermal performance improves, but fabrication precision requirements increase
Solution Approach 1:
The conductive assembly provides both electrical connection and thermal dissipation through its integrated structure. The same components that establish electrical contact also serve as thermal pathways, eliminating the need for separate thermal management structures and reducing precision requirements for creating exposed surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances thermal dissipation and electrical connectivity, reduces parasitic effects, and simplifies fabrication, resulting in higher power density and lower electrical resistance, while enabling efficient chip-scale packaging with improved reliability and visual inspection capabilities.
Implementation Method 1
enhances thermal dissipation and electrical connectivity
Implementation Method 2
enhances thermal dissipation and electrical connectivity, lowers electrical resistance
Data Source
AI summary
A power semiconductor device package includes a conductive assembly including a connecting structure and a semiconductor die having an aperture formed therethrough, the aperture being sized and configured to spacedly receive the connecting structure. In an alternative embodiment, a power semiconductor device package includes a conductive assembly including a connecting structure and a pair of semiconductor die disposed on either side of the connecting structure in spaced relationship thereto.