Power Semiconductor Device Plastic Deformation Sealing
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Solution Overview
Problem
The existing power semiconductor devices face challenges in productivity due to the complexity of the sealing process and heat dissipation requirements, particularly in in-vehicle applications where high heat dissipation is necessary for efficient operation.
Innovation Solution
A power semiconductor device design featuring a circuit portion with a conductor and a power semiconductor element between two base portions, where a transfer mold member is used to fill the space between these portions, allowing for plastic deformation of the base portions to accommodate assembly tolerances and prevent resin leakage, thereby simplifying the manufacturing process and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing body and case are crimped and sealed with potting resin as in PTL 1, then the semiconductor element is protected, but the manufacturing process requires additional sealing steps that reduce productivity
Solution Approach 1:
The invention combines the sealing body and case into a single integrated structure where the case itself forms the sealing enclosure. The semiconductor element is mounted directly on the heat dissipation plate within the case, eliminating the need for separate sealing body crimping and potting resin application. This merging of functions achieves both reliable sealing and improved manufacturing productivity.
2Stability of the object's composition
If the base portion is rigid to maintain structural stability, then assembly precision is maintained, but stress concentrates on the semiconductor element during plastic deformation
Solution Approach 1:
The base portion is segmented into a rigid case body and a flexible sealing portion. The case body maintains structural stability and positioning precision, while the sealing portion is designed to be plastically deformable to absorb stress during assembly. This segmentation allows the rigid and flexible functions to be separated, protecting the semiconductor element while maintaining overall structural integrity.
3Reliability
If additional steps like forming insulating layers and heat radiation fins are included, then device functionality is enhanced, but manufacturing complexity and time increase
Solution Approach 1:
The case is designed to perform multiple functions simultaneously: it provides structural support, serves as the sealing enclosure, acts as the heat dissipation structure through its thermally conductive material, and provides the mounting surface for the semiconductor element. This multi-functionality eliminates the need for separate insulating layers and heat radiation fins, reducing manufacturing steps while maintaining full device functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves productivity by reducing the stress on semiconductor elements during assembly, preventing resin leakage, and eliminating the need for additional steps like forming insulating layers and heat radiation fins, while ensuring high waterproofness and reliability through metal fusion bonding.
Implementation Method 1
a first bent portion that connects the first flat portion and another portion of the first base portion and is plastically deformed
Data Source
AI summary
An object is to improve the productivity of a power semiconductor device. A power semiconductor device according to the invention includes a circuit portion having a conductor for transmitting a current and a power semiconductor element, a first base portion and a second base portion facing each other with the circuit portion interposed therebetween, and a transfer mold member which is in contact with the conductor and the power semiconductor element and is filled in a space between the first base portion and the second base portion. The first base portion includes a first flat portion that is connected to a peripheral edge of the first base portion, and a first bent portion that connects the first flat portion and another portion of the first base portion and is plastically deformed. The transfer mold member is integrally configured in contact with the first flat portion.