Power Semiconductor Device with Pressure-Connected Capacitors
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Solution Overview
Problem
Power semiconductor devices face mechanical failure due to electrical disconnection between capacitors and the substrate under shock and vibration loads, leading to malfunction.
Innovation Solution
A power semiconductor device design featuring electrically conductive contact surfaces and pressure elements that ensure reliable electrical connection between capacitors and the substrate through resilient pressure elements and a capacitor holding element, which compensates for tolerances and applies a constant pressure force, preventing disconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rigid, inflexible contact feet are used to connect capacitor electrical connection elements to the substrate, then electrical connection is established, but mechanical failure occurs under shock and vibration loads
Solution Approach 1:
The patent uses flexible printed circuit boards (FPC) as capacitor connection elements instead of rigid contact feet. The FPC includes a flexible substrate with conductive patterns that can bend and deform elastically under mechanical shock and vibration loads, maintaining electrical connection while absorbing mechanical stress. This directly applies the principle of using flexible structures to replace rigid ones in environments subject to mechanical stress.
Solution Approach 2:
The patent changes the mechanical parameters of the capacitor connection elements by using materials and structures with appropriate flexibility and elasticity. The FPC is designed with specific thickness, material composition, and structural characteristics that allow it to deform under load and return to its original position, transforming the connection from rigid to resilient. This parameter change enables the connection to withstand shock and vibration while maintaining electrical continuity.
2Reliability
If pressure elements are added to ensure constant electrical contact, then connection reliability improves, but device complexity increases
Solution Approach 1:
The patent merges the capacitor housing with the pressure-generating structure by integrating the pressing element directly into the housing design. The housing includes an inclined pressing surface that converts capacitor insertion force into continuous contact pressure on the FPC connection elements. This integration eliminates the need for separate pressure elements, springs, or adjustment mechanisms, reducing overall device complexity while maintaining reliable electrical contact.
Solution Approach 2:
The patent implements a self-adjusting pressure mechanism where the capacitor housing automatically generates and maintains contact pressure through its structural design. The inclined pressing surface converts the mechanical force of capacitor insertion into continuous pressure on the FPC, and the housing structure itself serves as the pressure-generating element. This self-service mechanism eliminates the need for external pressure control systems, adjustment screws, or separate fastening devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures a reliable and constant electrical connection between capacitors and the substrate, preventing malfunction under mechanical stress and maintaining device functionality.
Implementation Method 1
a first spring element, wherein the capacitor is arranged in the normal direction of the substrate between the first spring element and the pressure element, the first spring element pressing the capacitor in the normal direction of the substrate against the pressure element
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
The invention relates to a power semiconductor device (1) with a substrate (3) having a first and a second electrically conductive contact surface (2a and 2b) on which power semiconductor components (4) are arranged and electrically connected to the substrate (3), and with an electrical capacitor (5) which has an electrically conductive first and a second capacitor connection element (5a and 5b) for the electrical connection of the capacitor, wherein the capacitor connection elements are electrically contacted with the substrate by pressure. The invention provides a power semiconductor device whose capacitors are reliably electrically connected to the substrate of the power semiconductor device. Figure 2.