Electric Power Source Device Stacked Component Layout
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Solution Overview
Problem
Conventional electric power source devices for hybrid and electric vehicles face inefficiencies due to unusable space when components of different sizes are stacked, leading to a need for improved space utilization on the mounting surface.
Innovation Solution
The electric power source device incorporates a transformer with primary and secondary coils, semiconductor modules, and a circuit substrate, where components are stacked in a direction perpendicular to the mounting surface, allowing substrate-side electrical components to occupy the unusable space adjacent to smaller components, effectively utilizing the entire surface area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If components of different sizes are stacked on the mounting surface to reduce overall surface area, then the horizontal footprint is reduced, but unusable space is generated around smaller components
Solution Approach 1:
The patent places substrate-side electrical components inside the exterior part of larger components in the horizontal direction, effectively nesting smaller components within the footprint of larger ones. This allows the circuit substrate to utilize the space around smaller stacked components, converting previously unusable space into functional mounting area and improving overall space utilization.
2Area of stationary object
If components are stacked in a direction perpendicular to the mounting surface, then the horizontal footprint is reduced, but the overall device size in vertical direction increases
Solution Approach 1:
The patent utilizes the third dimension (vertical direction) by stacking components perpendicular to the mounting surface, thereby reducing the horizontal footprint. Simultaneously, it employs horizontal placement of substrate-side components to fill gaps, creating a hybrid arrangement that optimizes both horizontal and vertical space utilization.
3Loss of substance
If substrate-side electrical components are placed in unusable space around stacked components, then space utilization is improved, but component arrangement complexity increases
Solution Approach 1:
The patent applies different arrangement strategies to different regions of the mounting surface. Substrate-side electrical components are specifically placed in the unusable space around smaller stacked components, while larger components maintain their primary stacking arrangement. This localized optimization improves space utilization without requiring complete redesign of the entire component layout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes the overall size of the device by utilizing previously unused space and enhances noise shielding performance by positioning substrate-mounting type transformers and electrical components to prevent external noise emission.
Implementation Method 1
The transformer has a primary coil and a secondary coil
Data Source
AI summary
An electric power source device has a transformer, a primary-side semiconductor module, a secondary-side semiconductor module, a secondary-side electrical component, a base plate and a circuit substrate on which substrate-side electrical components are mounted. The primary-side semiconductor module has a larger exterior size than the secondary-side electrical component. The primary-side semiconductor module and the secondary-side electrical component form a stacked section. In the stacked section, the secondary-side electrical component is stacked, in a vertical direction, i.e. a direction of a normal line of a mounting surface of the base plate, on the primary-side semiconductor module. The primary-side semiconductor module is directly mounted on the mounting surface. At least a part of the substrate-side electrical components is arranged inside of the primary-side semiconductor module in a horizontal direction, and inside of a second surface of the stacked section toward the mounting surface along the normal line.