Power Stage and Inductor Layout for Lower VRM Thermal Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional voltage regulator modules have thermal resistances above 5.2K/W, which are insufficient for high-power applications requiring lower thermal resistance.
Innovation Solution
The design incorporates a power stage package with a first pad for phase current output and a second pad without phase current, connected via an inductor with a metallic clip or body for thermal contact, creating parallel thermal paths to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional inductor-cooled power stage modules are used, then thermal resistance is reduced to 5.2K/W, but this is still insufficient for high power applications requiring even lower thermal resistance
Solution Approach 1:
The power stage package is divided into separate pads (first pad for phase current output, second pad for thermal contact only) that serve distinct functions. This segmentation allows the second pad to be dedicated purely to thermal management without carrying phase current, enabling more efficient heat dissipation paths and achieving thermal resistance below 5.2K/W
Solution Approach 2:
A metallic clip or body is introduced as an intermediary element that provides direct thermal contact between the second pad of the power stage package and the heat sink. This intermediary creates an additional parallel thermal path that enhances heat dissipation capability and reduces overall thermal resistance beyond what conventional inductor-cooled designs achieve
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves thermal resistance below 5.2K/W by providing additional thermal paths, effectively managing heat dissipation in high-power applications.
Implementation Method 1
a metallic body in thermal contact with the second pad of the power stage package
Data Source
AI summary
A voltage regulator module includes: a substrate having power input and output terminals; a power stage package mounted to the substrate and having first and second pads at a side facing away from the substrate, the power stage package configured to receive an input voltage from the power input terminal and output a phase current at the first pad; an inductor having a vertical conductor embedded in a magnetic core, the vertical conductor having a first end attached to the first pad of the power stage package and an opposite second end; and a metallic clip attached to each of the second end of the vertical conductor, the power output terminal, and the second pad of the power stage package. The second pad of the power stage package does not carry any of the phase current.