PRAM Heating Electrode with Positive Temperature Coefficient

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Solution Overview

Problem

Phase change random access memory (PRAM) devices require high temperatures for programming, leading to high power consumption and difficulties in integration due to the need for wide MOS transistors and large cell areas.

Innovation Solution

A PRAM design incorporating a heating electrode made of materials with a positive temperature coefficient, such as barium titanate, which increases specific resistance with temperature, allowing for efficient heat supply with reduced programming current by exploiting high resistance at elevated temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If high temperature heating is applied to convert phase change material state, then phase change is achieved, but power consumption increases significantly

Engineering Contradiction:
Improveheating temperatureVSAvoidpower consumption
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent changes the electrical resistance parameter of the heating electrode by selecting materials with positive temperature coefficient (PTC) characteristics. As temperature increases, the electrode's resistance increases, which automatically limits the current and reduces power consumption at high temperatures while maintaining effective heating capability.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The heating electrode with PTC characteristics provides self-regulating heating. When the temperature reaches a certain level, the increased resistance automatically reduces the power input, preventing overheating and reducing overall power consumption without requiring external control mechanisms.

Inventive Principle:
Principle #25Self-service

2Power

If channel width of MOS transistor is widened to supply high program currents, then sufficient current for phase change is achieved, but cell area increases

Engineering Contradiction:
Improveprogram currentVSAvoidcell area
Core Design Contradiction:
PowerVSArea of stationary object

Solution Approach 1:

The patent changes the electrical resistance parameter of the heating electrode by selecting materials with positive temperature coefficient (PTC) characteristics. As temperature increases, the electrode's resistance increases, which automatically limits the current and reduces power consumption at high temperatures while maintaining effective heating capability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces power consumption and enables high integration by minimizing the programming current while maintaining low resistance for swift read operations, thus achieving low power consumption and efficient programming.

Implementation Method 1

the heating electrode is formed of a material having a positive temperature coefficient such that specific resistance of the material increases with temperature

Methodology Applied
Scientific EffectPositive temperature coefficient: Electrical Resistance

Implementation Method 2

PRAM devices use Joule (ohmic) heating to set the state of its phase change materials

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 3

A phase change random access memory (PRAM) is a memory device that uses a material that changes its phase, e.g., amorphous to crystalline, as a mechanism to store data

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS7667998B2Phase change memory device and method of forming the same
Publication Date: 2010.02.23 SAMSUNG ELECTRONICS CO LTD
  • US7667998B2 patent drawing
  • US7667998B2 patent drawing
  • US7667998B2 patent drawing

AI summary

A PRAM and method of forming the same are disclosed. In various embodiments, the PRAM includes a lower insulation layer formed on a semiconductor substrate, a phase change material pattern formed on the lower insulation layer and a heating electrode contacting the phase change material pattern. The heating electrode can be formed of a material having a positive temperature coefficient such that specific resistance of the material increases as a function of temperature.