Pre-compressed Ceramic Armor via Thermal Bonding
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Solution Overview
Problem
Current ceramic-based ballistic armor is expensive to manufacture, has weakened connection points, and lacks multi-hit capabilities due to the fragility of individual tiles, which are prone to damage from repeated impacts.
Innovation Solution
A pre-compressed ceramic-based anti-ballistic article is created by bonding a high thermal expansion material with a higher expansion coefficient to the ceramic plate or tile at elevated temperatures, inducing compression stress upon cooling, which enhances the ceramic's ballistic performance and reduces damage from impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate ceramic tiles are used to create multi-hit capability, then the armor can withstand multiple impacts, but the connection lines and junctions become weakened points and manufacturing becomes expensive
Solution Approach 1:
The patent merges multiple ceramic tiles into a single monolithic structure, eliminating the need for separate tiles and their connections. This unified approach removes the weakened junction points while maintaining multi-hit capability through the monolith's inherent durability and stress distribution properties.
Solution Approach 2:
The patent segments the monolithic ceramic into controlled fracture zones that can absorb multiple impacts. The internal structure is designed to allow controlled cracking that doesn't compromise overall integrity, enabling multi-hit capability without requiring separate physical tiles.
2Reliability
If separate ceramic tiles are connected together to form multi-hit armor, then multiple impacts can be withstood, but the connection lines create weakened points from a ballistic point of view
Solution Approach 1:
The patent combines multiple ceramic elements into a single monolithic structure, eliminating connection lines entirely. This removes the ballistic weak points that would exist at tile junctions, as the monolith presents a continuous, uniform surface without seams or bonding interfaces that could fail under impact.
3Weight of moving object
If monolithic ceramic plates are used for ballistic protection, then lightweight protection is achieved, but multi-hit capabilities are lacking due to fragility from repeated impacts
Solution Approach 1:
The patent applies pre-compression stress to the monolithic ceramic structure before it encounters ballistic threats. This pre-stressing puts the ceramic in a state of compression that allows it to better absorb and distribute impact forces from multiple hits, preventing catastrophic failure that would occur in unstressed monoliths.
Solution Approach 2:
The patent changes the stress state parameter of the monolithic ceramic from unstressed to pre-compressed. By modifying the internal stress parameters through pre-compression, the ceramic's mechanical properties are enhanced to withstand repeated impacts while maintaining its lightweight monolithic structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a lightweight, cost-effective, and multi-hit capable ceramic armor with reduced spall and debris ejection angles, increased durability, and a decreased thickness, allowing for more effective protection against ballistic threats.
Implementation Method 1
bonding a high thermal expansion material having a much higher expansion coefficient than the ceramic material, to the ceramic plate/tile at elevated temperature
Implementation Method 2
Upon cooling, the thermal expansion material contracts, exerting compression stress on the ceramic plate/tile
Data Source
AI summary
An antiballistic article (100A) comprising a ceramic plate/tile (104) bonded to a thermal expansion material (102) with an adhesive (106), characterized, in that: the thermal expansion material has a thermal expansion coefficient higher than the ceramic plate/tile, and the thermal expansion material is bonded to the ceramic plate/tile at elevated temperature of between 50°C and 650°C with adhesive and subsequently cooled, whereby upon cooling, the bonded thermal expansion material contracts to a greater extent than the ceramic plate/tile, exerting compression stress on the ceramic plate/tile.


