Pre-heat Ring Radial Extension for Uniform Gas Heating
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Solution Overview
Problem
In semiconductor manufacturing, the existing pre-heat rings for chemical vapor deposition processes inadequately heat the process gas before it enters the reaction chamber, leading to non-uniform substrate temperature and deposition issues, particularly in reduced pressure epitaxy where slight temperature variations cause crystal face slip and non-uniform thin film deposition.
Innovation Solution
A pre-heat ring design with an extending part corresponding to the gas injection port to increase the pre-heat distance of the process gas, combined with recessed parts on the bottom surface to reduce thermal resistance and a lightweight structure, ensuring uniform heating and efficient gas flow without altering the gas flow speed or direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a pre-heat ring is arranged at the periphery of the bearing disk to heat the process gas, then the process gas can be preheated before entering the reaction chamber, but the pre-heat distance is insufficient and the process gas is not heated to the preset temperature uniformly
Solution Approach 1:
The pre-heat ring extends in the radial direction to increase the pre-heat distance. Specifically, the pre-heat ring includes a first section corresponding to the gas injection port and a second section extending radially outward, creating additional heating path length without increasing the axial or circumferential dimensions. This dimensional approach solves the contradiction by providing sufficient pre-heat distance while maintaining a compact overall structure.
Solution Approach 2:
The pre-heat ring is divided into multiple sections: a first section corresponding to the gas injection port and a second section extending radially outward. This segmentation allows different portions of the ring to perform specialized heating functions, with the extended second section providing additional pre-heat distance specifically where needed to ensure uniform temperature distribution across the substrate surface.
2Temperature
If the pre-heat ring is extended radially to increase pre-heat distance, then uniform heating is improved, but the weight and thermal resistance of the pre-heat ring increase
Solution Approach 1:
The pre-heat ring features localized structural optimizations including recessed parts in the second section that reduce material density in specific areas. These recessed portions decrease the overall weight and thermal resistance of the pre-heat ring while maintaining the radial extension needed for sufficient pre-heat distance. This local quality modification resolves the contradiction by providing uniform heating performance without the penalty of increased weight.
3Ease of manufacture
If the pre-heat ring structure is simplified to reduce weight, then manufacturing is easier, but the heating efficiency and temperature control precision deteriorate
Solution Approach 1:
The pre-heat ring incorporates recessed parts in the second section that strategically remove material to reduce weight and thermal resistance. These recessed features are designed to maintain structural integrity and heating efficiency while simplifying the overall structure. The localized modification approach enables easier manufacturing through standard machining processes while preserving the temperature control precision needed for uniform substrate heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced pre-heat ring design ensures consistent substrate temperature, improves wafer production efficiency, reduces gas usage, and allows for a smaller reaction chamber volume while maintaining process control and reducing the pre-heat ring's weight and thermal resistance.
Implementation Method 1
a pre-heat ring is arranged at the periphery of the bearing disk, so that the process gas is heated by the pre-heat ring in advance
Implementation Method 2
the process gas is heated by the pre-heat ring in advance
Implementation Method 3
the first section of the outer periphery includes an extending part formed by extending towards a gas injection port side
Implementation Method 4
the first section of the outer periphery includes an extending part formed by extending towards a gas injection port side in at least part of areas of the first section along a radial direction of the pre-heat ring
Data Source
AI summary
A pre-heat ring for a substrate processing device, which includes: a reaction chamber, a bearing disk, the pre-heat ring and a gas injection port. The bearing disk is arranged in the reaction chamber and supports a substrate; the pre-heat ring is arranged around the bearing disk; a supporting piece is arranged in the reaction chamber and supports the pre-heat ring; the gas injection port is formed in the reaction chamber and introduces a process gas; the pre-heat ring includes a ring body; the inner periphery and the outer periphery of the ring body each include a first section and a second section, the first section corresponds to the gas injection port, and the second section does not correspond to the gas injection port; and the first section of the outer periphery extends towards a gas injection port side.