Pre-imidized Polyimide Resin for Low-Temperature Fine Patterning
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Solution Overview
Problem
Current negative photosensitive resin compositions for semiconductor devices face challenges in achieving high resolution, rectangular pattern formation, and maintaining mechanical characteristics and adhesiveness to substrates, especially when cured at low temperatures.
Innovation Solution
A negative photosensitive resin composition comprising an alkali-soluble resin, a crosslinkable polymer compound with specific structural units, a light-generated acid compound, and a crosslinking agent, which allows for solubility in alkaline aqueous solutions and enables the formation of fine patterns with high resolution and excellent mechanical characteristics and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If imidization treatment at high temperature exceeding 300°C is performed to obtain polyimide film, then the polyimide film has excellent electric characteristics and mechanical characteristics, but the underlying substrate is restricted to endure this high temperature and the copper of the wiring is oxidized
Solution Approach 1:
The patent changes the key parameter of treatment temperature from high temperature (exceeding 300°C) to low temperature (100-300°C). This is achieved by using a pre-imidized polyimide resin instead of requiring in-situ imidization, thereby avoiding the harmful high temperature effects on substrates and copper wiring while maintaining the excellent properties of polyimide film
Solution Approach 2:
The polyimide resin is pre-imidized before being incorporated into the photosensitive composition. This preliminary action of imidization allows the resin to be applied at low temperatures without requiring high-temperature treatment during the actual device fabrication process, thus protecting the substrate and copper wiring
2Ease of manufacture
If a photosensitive polyimide material using polyamic acid is used, then the material can form patterns, but imidization treatment at high temperature exceeding 300°C is indispensable to obtain the target polyimide film
Solution Approach 1:
The patent changes the treatment temperature parameter from high temperature (exceeding 300°C) to low temperature (100-300°C) by using a pre-imidized polyimide resin in the photosensitive composition, eliminating the need for high-temperature imidization treatment during pattern formation
Solution Approach 2:
The patent uses a composite material system consisting of pre-imidized polyimide resin combined with a photosensitive group and a crosslinking agent. This composite approach allows the material to exhibit both the thermal stability of polyimide and the pattern formation capability of photosensitive materials without requiring high-temperature treatment
3Strength
If crosslinking agents having methylol groups are used to improve mechanical strength, then the cured film has improved mechanical strength, but the pattern shape rectangularity and resolution of fine patterns are insufficient
Solution Approach 1:
The patent uses a composite crosslinking system combining multiple types of crosslinking agents (epoxy compounds, carboxylic acid compounds, and/or isocyanate compounds) with the pre-imidized polyimide resin. This composite approach achieves both improved mechanical strength and excellent pattern formation characteristics including rectangularity and fine pattern resolution
Solution Approach 2:
The patent employs different crosslinking agents that provide different local properties: epoxy compounds for mechanical strength, carboxylic acid compounds for pattern rectangularity, and isocyanate compounds for fine pattern resolution. Each crosslinking agent contributes specific local quality to achieve overall optimal performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high resolution and rectangular pattern formation while maintaining excellent mechanical characteristics and adhesiveness to substrates, even when cured at low temperatures, enhancing the reliability of semiconductor devices.
Implementation Method 1
a compound that generates an acid by light
Implementation Method 2
a crosslinkable polymer compound having a group crosslinked with the component (A)... and a crosslinking agent other than the component (B)
Data Source
Figure 1
AI summary
The present invention is a negative photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); (C) a compound that generates an acid by light; and (D) a heat crosslinking agent. An object of the present invention is to provide a negative photosensitive resin composition that enables formation of a fine pattern with high rectangularity and high resolution, has excellent mechanical characteristics even when cured at low temperatures, and furthermore, has no degradation in adhesive force between before and after a high temperature and high humidity test.