Multi-layer PCB Miniaturization via Prepreg Core Replacement
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Solution Overview
Problem
Conventional multi-layer printed circuit boards (PCBs) face challenges in miniaturization due to high manufacturing costs, increased design and manufacturing complexity, and thermal and power issues, which hinder their widespread application and efficiency.
Innovation Solution
The solution involves replacing core layers with prepreg substrate layers in multi-layer PCBs, enhancing structural integrity, reducing stack height, and implementing a shared grounding system, reduced decoupling capacitors, and ferrite beads to improve power distribution and thermal management, thereby increasing component density and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional multi-layer PCB designs are used, then electrical performance and signal integrity are improved, but manufacturing cost and design complexity increase significantly
Solution Approach 1:
The PCB is divided into functional modules (analog section, digital section, RF section) that can be independently designed and manufactured. Each module has its own ground plane and power distribution, allowing parallel development and reducing overall design complexity while maintaining electrical performance
Solution Approach 2:
The patent transitions from planar 2-layer PCB design to 3D multi-layer stacking with alternating signal and ground layers. This vertical dimensionality enables better signal integrity through controlled impedance and reduced crosstalk, while the modular layer structure simplifies the design process
2Quantity of substance
If more layers are added to the PCB, then component density and functionality increase, but manufacturing cost and thermal management difficulty increase
Solution Approach 1:
Adjacent ground layers are merged into a single continuous ground plane in the vertical dimension, reducing the number of separate ground layers needed. This merging reduces manufacturing complexity and cost while maintaining effective ground reference for high-density signal routing
Solution Approach 2:
The ground planes serve multiple functions simultaneously: electrical reference, heat dissipation path, EMI shielding, and mechanical support structure. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process
3Strength
If core layers are retained in traditional multi-layer PCBs, then structural support is provided, but stack height increases and miniaturization is hindered
Solution Approach 1:
Traditional solid core layers are extracted and replaced with alternating prepreg and ground plane layers. This extraction reduces stack height while the ground planes provide the necessary mechanical support and electrical function, enabling miniaturization without sacrificing structural integrity
4Object-affected harmful factors
If separate grounding systems are used for analog and digital sections, then noise isolation is improved, but decoupling capacitor requirements and power distribution complexity increase
Solution Approach 1:
The patent separates analog and digital grounds in the vertical dimension through alternating ground layers rather than requiring separate physical ground planes. This vertical separation provides noise isolation while maintaining a unified power distribution architecture, reducing complexity
Data Source
AI summary
A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include signal layers, ground plane layers, inner signal layers, and a single core substrate layer. Each of the layers may be separated from the other layers by at least one prepreg substrate layer.