Press Fitting Head With Transparent Alignment Mark Recognition Area
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Solution Overview
Problem
Current die attach apparatuses face limitations in accuracy due to the inability to recognize feature patterns on semiconductor devices after they are held by the fitting unit, leading to potential misalignment and displacement issues during the mounting process.
Innovation Solution
A press fitting head with an elastic member and an alignment mark recognition area that can detect optically readable markers on the semiconductor device, allowing for precise positioning and correction of the device during the mounting process, while also using a transparent fixing portion to prevent deformation and ensure stable contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the fitting part is formed of an opaque elastic material to deform and contact the semiconductor device, then the fitting part can be brought into close contact with the semiconductor device, but the feature pattern on the semiconductor device cannot be recognized after the fitting unit holds the device
Solution Approach 1:
The press fitting head is divided into two distinct functional regions: an elastic member for contact and holding, and a transparent member for optical recognition. This segmentation allows each part to optimize its specific function without compromising the other.
Solution Approach 2:
Different parts of the press fitting head have different optical properties: the elastic member region is opaque for stable contact, while the alignment mark recognition area is transparent for feature pattern detection. This local differentiation resolves the contradiction between contact stability and pattern recognition.
2Manufacturing precision
If the die attach apparatus corrects position based on feature pattern recognition before fitting, then positioning accuracy is improved, but no correction can be made after the fitting unit holds the semiconductor device
Solution Approach 1:
The apparatus performs preliminary feature pattern recognition and position correction before the semiconductor device is held by the fitting unit. This preliminary action ensures accurate positioning is established in advance, maintaining high manufacturing precision without requiring complex post-holding correction mechanisms.
3Productivity
If the fitting unit moves the semiconductor device to the mounting body, then the mounting process is completed, but displacement occurs causing misalignment
Solution Approach 1:
The transparent alignment mark recognition area enables real-time feedback on the semiconductor device's position and alignment status during the moving and mounting process. This feedback allows for continuous monitoring and correction, maintaining alignment accuracy while enabling efficient mounting operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the accuracy and stability of semiconductor device mounting by allowing for real-time recognition and correction of alignment, reducing the risk of misalignment and damage during the die attach process.
Implementation Method 1
The fitting part is formed of an elastic material so as to deform in accordance with the shape of the semiconductor device when the fitting unit fits and holds the semiconductor device
Implementation Method 2
an alignment mark recognition area capable of detecting an optically readable marker provided on a surface which is contacted to the semiconductor device
Data Source
AI summary
A press fitting head comprising an elastic member in a part where the press fitting head contacts a semiconductor device, and an alignment mark recognition area capable of detecting an optically readable marker provided on a surface to be contacted to the semiconductor device is provided. Additionally, a semiconductor manufacturing apparatus in which the press fitting head is applied is provided.