Press-Forming Device for Solder Wire Processing
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Solution Overview
Problem
Existing solder body production methods require complex apparatus designs, significant assembly effort, and large installation space due to the need for separate storage and handling of solder balls, which also necessitate the use of flux.
Innovation Solution
A press-forming device that transforms a continuous solder wire into a strand of equidistant preformed solder sections connected by notches, allowing for the efficient production of individual solder bodies using a simple and compact mechanism, eliminating the need for flux and reducing manufacturing effort.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate reservoirs are used to hold solder balls, then precise handling and application of solder bodies is achieved, but device complexity and assembly effort increase significantly
Solution Approach 1:
The patent merges the storage and delivery functions into a single continuous wire feed system, eliminating separate reservoirs. The wire is fed continuously through a laser heating zone and deposition nozzle, combining material storage, transport, and application into one integrated mechanism, thereby reducing device complexity while maintaining precise handling through controlled wire feeding and laser positioning.
Solution Approach 2:
The patent extracts the solder material from discrete spherical forms held in reservoirs and transforms it into a continuous wire format. This extraction of material from its traditional spherical reservoir storage enables a fundamentally simpler feed mechanism while the laser selectively melts and deposits material precisely where needed, achieving handling precision without complex reservoir systems.
2Manufacturing precision
If separate reservoirs and complex shaping mechanisms are used, then solder bodies can be handled precisely, but manufacturing effort and installation space increase
Solution Approach 1:
The patent replaces complex mechanical shaping and handling mechanisms with a laser-based system. Instead of using mechanical reservoirs, shuttles, and positioning mechanisms to handle spherical solder balls, the system uses laser heating to melt wire material and a controlled feed mechanism to deliver it, substituting mechanical complexity with optical and thermal processes that require less manufacturing effort and space.
Solution Approach 2:
The patent changes the physical state and form of the solder material from discrete spherical balls to a continuous wire that is selectively melted. This parameter change in material form eliminates the need for complex mechanical handling of individual spheres, reducing manufacturing effort while maintaining precision through controlled melting and deposition parameters.
3Manufacturing precision
If traditional solder ball methods are used, then solder application is achieved, but flux must be used and manufacturing complexity increases
Solution Approach 1:
The patent extracts the flux requirement from the soldering process by using laser-heated wire deposition. Instead of applying pre-formed solder balls that require flux for proper adhesion and melting, the system melts wire material in situ and deposits it directly onto the joint, eliminating the need for flux and the associated handling and application complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, flux-free, and cost-effective production of solder bodies with precise control and minimal mechanical loads, reducing manufacturing complexity and space requirements while maintaining precise handling and application.
Implementation Method 1
using first and second notched rollers that rotate in opposite directions and that radially press opposite notches into the wire
Implementation Method 2
wherein the individual solder bodies are jetted from the solder body holding capillary using gas pressure applied into the solder body holding capillary
Data Source
AI summary
A press-forming device for forming individual solder bodies from a wire of soldering material includes a press-forming mechanism and a separation means. The press-forming mechanism forms a continuous strand of preformed solder sections from the wire by using two notched rollers that rotate in opposite directions and that press opposite notches into the wire. The preformed solder sections are disposed equidistantly along the strand and are connected to each other by connecting links disposed at the notches. The separation means forms individual solder bodies by separating the preformed solder sections one by one at the connecting links. The separation means separates individual preformed solder sections using a cutting mechanism that moves in a direction perpendicular to the length direction of the strand. Individual solder bodies are transported to a solder jetting section where they are liquefied by a laser beam and jetted from the solder jetting section by gas pressure.