Printable Semiconductor Transfer via Conformable Device
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Solution Overview
Problem
Current methods for fabricating flexible electronic devices on plastic substrates face challenges such as incompatibility with traditional silicon-based technologies, limited electronic performance due to the use of amorphous or hybrid organic-inorganic semiconductors, and mechanical strain issues with rigid device components, leading to suboptimal field effect mobilities and device durability.
Innovation Solution
A method involving the transfer and assembly of printable semiconductor elements, such as single crystalline silicon ribbons, using bridge elements connected to a mother wafer and transferred via a conformable device, allowing for high precision registration and integration onto plastic substrates without exposure to high temperatures, enabling flexible and high-performance electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional high temperature processing methods are used for inorganic semiconductors, then high electronic performance is achieved, but the plastic substrate melts or decomposes
Solution Approach 1:
The fabrication process is divided into two separate stages: (1) high-temperature processing of inorganic semiconductor components on a sacrificial substrate, and (2) transfer of the processed components to the plastic substrate at low temperature. This segmentation allows each stage to occur under optimal conditions without compromising the other.
Solution Approach 2:
A sacrificial substrate serves as an intermediary medium that temporarily supports the inorganic semiconductor components during high-temperature processing. After processing, the components are transferred from this intermediary substrate to the final plastic substrate, enabling high-temperature fabrication without exposing the plastic to damaging temperatures.
2Adaptability or versatility
If amorphous or hybrid organic-inorganic semiconductors are used, then compatibility with plastic substrates is achieved, but field effect mobility is limited to approximately three orders of magnitude less than single crystalline silicon
Solution Approach 1:
The device structure is segmented into inorganic semiconductor components (providing high mobility) and plastic substrate components (providing flexibility and compatibility). The inorganic components are processed separately and then integrated with the plastic substrate, allowing each material to contribute its advantageous properties without compromise.
Solution Approach 2:
The invention creates a hybrid device structure combining inorganic semiconductor materials with high field effect mobility and plastic substrate materials with good flexibility and compatibility. This composite approach allows the system to exhibit both high electronic performance and substrate adaptability.
3Stability of the object's composition
If rigid device components are used on plastic substrates, then structural stability is achieved, but mechanical strain causes damage and performance degradation
Solution Approach 1:
The inorganic semiconductor components are processed into thin-film structures that can flex and deform with the plastic substrate without breaking. These thin-film components maintain their structural integrity under mechanical strain while preserving their electronic functionality, enabling flexible devices with durable inorganic components.
Data Source
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AI summary
The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.