3D-Printed Circuit Structures with Optical Alignment for Low Signal Loss
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Solution Overview
Problem
Current 3D printed circuit fabrication methods face limitations in achieving high performance, low signal loss, and high circuit density due to material sets, printing methods, and system constraints, which hinder their use in commercial production and high-frequency applications.
Innovation Solution
A hybrid 3D printing platform combining multiple deposition methods and post-processing techniques, utilizing particle-free metal inks, low-loss dielectric materials, and optical alignment, enables precise multi-layer circuit construction with exposed terminations on both sides, replacing conventional laminated circuit fabrication processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional laminated circuit fabrication processes are used, then manufacturing reliability is maintained, but manufacturing complexity and production time increase
Solution Approach 1:
The patent combines multiple fabrication operations (laminating, imaging, etching, drilling, plating, trimming) into a single 3D printing process that deposits conductive and dielectric materials layer-by-layer to directly form circuit structures, eliminating the need for separate processing steps and reducing overall manufacturing complexity
Solution Approach 2:
The 3D printing platform performs multiple functions including material deposition, circuit pattern formation, dielectric layer creation, and structural support provision within a single system, replacing the need for multiple specialized equipment and processes used in conventional fabrication
2Ease of manufacture
If material thickness is increased for ease of handling, then ease of manufacture improves, but impedance control precision deteriorates
Solution Approach 1:
The patent changes the thickness parameter of dielectric layers from conventional thick sheets to precisely controlled thin layers (e.g., 1-10 micrometers) deposited by 3D printing, enabling both easy handling through systematic processing and precise impedance control through accurate thickness management
Solution Approach 2:
The patent replaces mechanical lamination and manual handling of thick materials with automated 3D printing deposition of thin layers, allowing precise thickness control through digital parameters while maintaining ease of manufacture through automated processing
3Ease of manufacture
If conventional particle-based metal inks are used, then ease of deposition improves, but signal loss increases
Solution Approach 1:
The patent changes the material composition from particle-based metal inks to particle-free metal inks, fundamentally altering the physical state of the conductive material to eliminate signal loss mechanisms associated with particle boundaries and contact resistance while maintaining depositability through optimized ink formulation
Solution Approach 2:
The patent uses composite material systems where particle-free metal inks are combined with specific binders and solvents to achieve both ease of deposition through proper rheology and low signal loss through continuous conductive pathways, creating a composite that optimizes both processing and electrical performance
4Manufacturing precision
If multi-layer circuit stacks are constructed with traditional methods, then circuit density can be achieved, but manufacturing time and complexity increase
Solution Approach 1:
The patent performs preliminary circuit pattern design and material selection in the digital domain before fabrication, allowing multi-layer circuit stacks to be constructed in a single automated printing process rather than through sequential manual or semi-automated fabrication steps, significantly reducing manufacturing time while maintaining high circuit density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The platform achieves high-performance, low signal loss circuits with customizable designs, comparable to conventional methods, allowing for commercial production and high-frequency applications, and eliminates the need for multiple standalone systems.
Implementation Method 1
One or more components of a printer are aligned with the one or more fiducials based on one or more images captured of the core with an optical camera of the printer
Implementation Method 2
A first dielectric layer is printed on a first side of the core. A second one or more circuit structures in the first dielectric layer
Data Source
AI summary
A method of creating a printed circuit board (PCB) is provided. The method includes a core having one or more fiducials thereon. The core includes a first one or more circuit structures. One or more components of a printer are aligned with the one or more fiducials based on one or more images captured of the core with an optical camera of the printer. A first dielectric layer is printed on a first side of the core. A second one or more circuit structures in the first dielectric layer. Printing a second dielectric layer on a second side of the core, the second side reverse of the first side. Printing a third one or more circuit structures in the second dielectric layer on the second side of the core.