3D Printed Electronic Device Layer Stacking Method

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Solution Overview

Problem

Conventional methods for manufacturing printed electromagnetic devices face challenges in creating structures that vary in size, functionality, and accuracy, and struggle to integrate electrical functions with mechanical structures effectively, particularly in 3D printing, where achieving optimal material properties and structural integrity is difficult.

Innovation Solution

A method involving 3D printing that starts with printing traces of electrical components on suitable substrates, modifying layers through heating, cutting, or etching, and stacking them with interconnectors to form multicomponent structures, allowing for the creation of complex devices like sensors and motor coils with precise electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional additive manufacturing is used to manufacture electromagnetic devices, then design constraints are reduced, but the ability to integrate electrical function with mechanical structure is insufficient

Engineering Contradiction:

Improvedesign flexibilityVSAvoidelectrical function integration

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The device is divided into multiple functional layers including substrate layer, conductive trace layer, dielectric layer, and magnetic core layer. Each layer is manufactured and modified separately before stacking, allowing optimization of electrical and mechanical properties in each layer independently while ensuring proper integration through interconnectors

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Interconnectors are introduced as intermediary components between stacked layers to establish electrical connectivity. These interconnectors serve as mediators that bridge the electrical functions across multiple layers while maintaining mechanical structural integrity of the assembled device

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If conventional lamination and winding methods are used, then structural integrity is maintained, but manufacturing complexity and cost increase

Engineering Contradiction:

Improvestructural integrityVSAvoidmanufacturing process complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

Traditional mechanical winding and lamination processes are replaced with additive manufacturing techniques. Conductive traces are directly printed onto substrates using deposition methods, and layers are stacked and bonded using controlled heating and pressing, eliminating complex winding operations and reducing manufacturing steps

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The manufacturing process utilizes parameter changes through controlled heating to modify material properties. Heating is applied to activate adhesives, sinter conductive inks, or cure dielectric layers, enabling strong bonding between layers and maintaining structural integrity through thermal parameter control rather than mechanical fastening

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If direct printed electronics are used for high volume manufacturing, then cost reduction is achieved, but three dimensional assembly capability is limited

Engineering Contradiction:

Improvemanufacturing costVSAvoidthree dimensional assembly

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The invention transitions from two-dimensional planar printing to three-dimensional stacked assembly. Multiple layers are printed separately in 2D and then assembled vertically in the third dimension through stacking and bonding, enabling complex 3D electromagnetic structures while maintaining the cost advantages of direct printing techniques

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Individual layers are prepared and modified in advance before final assembly. Conductive traces are printed, dielectric layers are cured, and magnetic cores are formed separately, then all layers are stacked and bonded in a final assembly step. This preliminary preparation enables efficient high-volume manufacturing while achieving complex 3D structures

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the fabrication of printed electronic devices with enhanced size, material diversity, and multiple functionalities, overcoming the limitations of traditional techniques by maintaining desired electrical and mechanical properties, suitable for micro, meso, and nano-sized circuits.

Implementation Method 1

printing traces of an electrical component on a substrate

Methodology Applied

Scientific EffectPrinting/Deposition: Deposition (physical)

Implementation Method 2

modifying layers through heating

Methodology Applied

Scientific EffectHeating: Heating

Data Source

PatentEP2966945B1Method for manufacturing layered electronic devices

Publication Date: 2024.02.07 HAMILTON SUNDSTRAND CORP

Figure 1
Figure 2~3

AI summary

A method for fabricating printed electronics includes printing (102) a trace of an electrical component on a first substrate to form a first layer (110). The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer (106). The first layer is stacked (112) with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified (104) after printing.