3D Printed Passive Components in Ceramic Blocks
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Solution Overview
Problem
Photolithography has limited value in integrating large capacitors, inductors, and resistors, leading to the continued use of discrete components, which are more expensive, bulky, and wasteful, due to its lack of a high-temperature fusing process.
Innovation Solution
The use of 3D printing to create passive components like multilayer ceramic capacitors, inductors, and resistors within a ceramic block, utilizing high-temperature sintering to enhance dielectric strength and integrate these components into the ceramic chip package, allowing for improved dielectric strength and reduced material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography is used to fabricate PCB and microprocessor, then manufacturing precision and productivity are improved, but the ability to integrate large passive components (capacitors, inductors, resistors) deteriorates
Solution Approach 1:
The patent merges the fabrication of active semiconductor circuits and passive components into a single integrated structure. The passive components are formed within the semiconductor device housing, combining previously separate discrete components into one unified device, thereby achieving both precision manufacturing and enhanced integration capability
Solution Approach 2:
The patent embeds passive components (capacitors, inductors, resistors) inside the semiconductor device housing, creating a nested structure where smaller components are contained within the larger device envelope. This nesting approach enables integration of large passive components without increasing the overall device footprint
2Reliability
If discrete components are used for capacitors, inductors, and resistors, then component functionality is achieved, but device volume and manufacturing cost increase
Solution Approach 1:
Multiple discrete passive components are merged into a single integrated structure within the semiconductor device. By combining capacitors, inductors, and resistors into one unified assembly housed within the semiconductor housing, the total device volume is reduced while maintaining all required functionalities
Solution Approach 2:
Passive components are nested inside the semiconductor device housing, utilizing the internal volume of the housing to accommodate capacitors, inductors, and resistors. This nested arrangement eliminates the need for separate discrete components, thereby reducing overall device volume
3Reliability
If discrete components are used for passive elements, then component requirements are met, but material waste and manufacturing complexity increase
Solution Approach 1:
The manufacturing process merges the production of passive components with the semiconductor fabrication process. By forming passive components using the same manufacturing steps and materials as the active circuits, material waste is minimized and manufacturing complexity is reduced while maintaining component performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of high-density, integrated passive components with increased functionality per unit volume and weight, reducing manufacturing costs by minimizing material usage and parasitic effects through precise control of component geometry and placement.
Implementation Method 1
Sintering of ceramic powder material provides an advantage over the prior art, such as, e.g., to produce an insulator layer that allows for an improvement in dielectric strength
Data Source
AI summary
Methods and systems to improve printed electrical components and for integration in circuits are disclosed. Passive components, e.g., capacitors, resistors and inductors, can be printed directly into a solid ceramic block using additive manufacturing. A grounded conductive plane or a conductive cage may be placed between adjacent electrical components, or around each component, to minimize unwanted parasitic effects in the circuits, such as, e.g., parasitic capacitance or parasitic inductance. Resistors may be printed in non-traditional shapes, for example, S-shape, smooth S-shape, U-shape, V-shape, Z-shape, zigzag-shape, and any other acceptable alternative configurations. The flexibility in shapes and sizes of the printed resistors allows optimal space usage of the ceramic block. The present invention also discloses an electrical component comprising combined predetermined values of capacitance, resistance and inductance. The integration and adjustability of a multi-property device can provide significant advantages in electronics manufacturing.