Probe Card Composite Body for Multi-Temperature Alignment
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Solution Overview
Problem
Conventional probe cards require multiple setups for different measuring temperatures, leading to increased complexity and cost, as they cannot accurately perform electric tests at two distinct temperatures without incorporating a heat source in the probe base plate, causing misalignment due to temperature-induced expansion differences between the probe base plate and the semiconductor wafer.
Innovation Solution
A probe card design featuring a composite body with a probe base plate and a heat expansion adjusting member, having a different linear expansion coefficient, which forms a composite body that maintains alignment at two measuring temperatures without a heat source in the probe base plate, using a heat expansion adjusting member bonded to the probe base plate to equalize expansion differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a probe base plate with equal linear expansion coefficient to the semiconductor wafer is used, then the expansion difference is reduced, but the alignment fails at temperatures other than the set measuring temperature
Solution Approach 1:
The patent changes the physical parameter of the probe base plate by bonding a heat expansion adjusting member with a different linear expansion coefficient to create a composite body. This composite structure has an effective linear expansion coefficient that differs from both individual components, allowing the expansion characteristics to be tuned for multi-temperature operation. The parameter change enables the probe positions to remain aligned with electrode positions across different measuring temperatures.
Solution Approach 2:
The probe base plate is constructed as a composite body by bonding the heat expansion adjusting member to the base plate. This composite structure combines materials with different thermal expansion properties to achieve a desired effective expansion coefficient. The composite design allows the system to compensate for temperature-induced expansion differences and maintain alignment precision across multiple measuring temperatures.
2Manufacturing precision
If a probe base plate with larger linear expansion coefficient is used to compensate temperature difference, then the alignment is maintained at set temperature, but the structure becomes more complex
Solution Approach 1:
Rather than selecting a single material with a larger expansion coefficient, the patent changes the effective expansion parameter by creating a composite structure. The heat expansion adjusting member is bonded to the probe base plate to modify its thermal expansion characteristics. This approach achieves the desired compensation effect while using standard materials and a relatively simple bonding structure.
Solution Approach 2:
The probe base plate system is segmented into two functional parts: the base plate itself and the heat expansion adjusting member. This segmentation allows each component to be optimized independently and bonded together to achieve the desired composite expansion coefficient. The adjusting member can be designed as a separate element with specific expansion properties that complement the base plate.
3Manufacturing precision
If multiple probe cards are prepared for different measuring temperatures, then the alignment precision is maintained, but the device complexity and cost increase
Solution Approach 1:
The probe card with the heat expansion adjusting member achieves multi-functionality by maintaining alignment precision across multiple measuring temperatures. The composite structure enables the single probe card to be used for testing at different temperatures without requiring temperature-specific configurations. This universal design eliminates the need for multiple specialized probe cards, reducing system complexity and cost.
Solution Approach 2:
The heat expansion adjusting member modifies the thermal expansion parameters of the probe base plate to create a composite body with tailored expansion characteristics. This parameter modification allows the probe card to maintain alignment accuracy across a range of temperatures, enabling one probe card to replace multiple temperature-specific cards.
4Temperature
If a heat source is incorporated in the probe base plate to control temperature, then the temperature control is improved, but the device complexity increases
Solution Approach 1:
Instead of adding active temperature control components, the patent changes the thermal expansion parameter of the probe base plate through the composite structure. The heat expansion adjusting member passively compensates for temperature-induced expansion differences, maintaining alignment without requiring active heating or cooling mechanisms in the probe base plate.
Solution Approach 2:
The heat expansion adjusting member provides self-service by automatically compensating for thermal expansion differences through its material properties and geometric configuration. The composite structure inherently adjusts for temperature variations without requiring external control systems, sensors, or active components in the probe base plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate electric testing at two measuring temperatures using a single probe card without a heat source in the probe base plate, ensuring alignment and reducing manufacturing complexity by allowing selection of materials based on desired expansion coefficients, thus overcoming temperature-induced expansion mismatches.
Implementation Method 1
a heat expansion adjusting member bonded to the probe base plate, having a different linear expansion coefficient from a linear expansion coefficient of the probe base plate so as to restrain heat expansion of the probe base plate
Implementation Method 2
the probe base plate of the probe card is located over the semiconductor wafer as the device under test and is basically heated by radiation heat from the chuck
Data Source
AI summary
A probe card for an electric test of a device under test on a working table incorporating a heat source includes a circuit base plate including conductive paths connected to a tester, a probe base plate including conductive paths corresponding to the conductive paths and provided with probes connected to the conductive paths, and a heat expansion adjusting member bonded to the probe base plate, having a different linear expansion coefficient from that of the probe base plate to restrain heat expansion of the probe base plate, and constituting a composite body with the probe base plate. In a case where, when the device under test is at two measuring temperatures, the composite body is at corresponding achieving temperatures, expansion changing amounts of the device under test and the composite body under temperature differences between the respective measuring temperatures and the corresponding achieving temperatures are set to be approximately equal.