Probe Card Double-Sided Layout for High Pin Count

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Solution Overview

Problem

Conventional probe cards are limited in accommodating a larger number of probe pins due to space constraints, leading to increased testing time and cost, and require redesigning of the test tool's securing units when trying to enhance probe pin capacity.

Innovation Solution

The probe apparatus features a modified circuit board layout with a larger size and rearranged components, allowing for a higher number of probe pins and capacitors, enabling efficient signal transmission and noise filtering without necessitating changes to the mother board or test tool design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the number of probe pins on the probe card is increased, then the testing efficiency and productivity are improved, but the space constraint on the probe card prevents accommodating more probe pins

Engineering Contradiction:
Improvetesting efficiencyVSAvoidprobe card space
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The patent utilizes both the front surface and back surface of the circuit board to accommodate components. The pogo pads are arranged on the front surface while the probe pins are disposed on the back surface, effectively doubling the available space for component placement and enabling increased probe pin count without expanding the overall probe card footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The circuit board is functionally segmented into two surfaces with distinct component placements. The front surface contains pogo pads for signal input, while the back surface contains probe pins for chip contact. This segmentation allows independent optimization of each surface's component layout, maximizing the total number of probe pins that can be accommodated.

Inventive Principle:
Principle #1Segmentation

2Quantity of substance

If the probe card size is enlarged to accommodate more probe pins, then the number of probe pins increases, but the securing unit of the mother board and the probe card structure require redesign

Engineering Contradiction:
Improvenumber of probe pinsVSAvoidsecuring unit and probe card structure
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

Instead of increasing the probe card's planar dimensions, the patent exploits the third dimension by utilizing both surfaces of the circuit board. This approach increases probe pin capacity while maintaining the same overall card size, thereby avoiding the need to redesign the securing unit and probe card structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Quantity of substance

If more probe pins are added to the probe card, then the testing capacity increases, but the testing time and cost increase due to over-wear of probe pins

Engineering Contradiction:
Improvetesting capacityVSAvoidtesting time
Core Design Contradiction:
Quantity of substanceVSLoss of time

Solution Approach 1:

The circuit board is divided into multiple regions with pogo pads and probe pins arranged in concentric patterns. This segmentation allows for better distribution of wear across multiple contact points and enables more efficient testing workflows, reducing the overall testing time and extending the operational life of the probe pins.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS7449902B2Probe system
Publication Date: 2008.11.11 POWERCHIP SEMICON MFG CORP
  • US7449902B2 patent drawing
  • US7449902B2 patent drawing
  • US7449902B2 patent drawing

AI summary

A probe apparatus and a probe system are provided. The probe apparatus uses a larger printed circuit board to dispose a plurality of testers. The layout of each of the testers on the circuit board is modified accordingly, such that more number of the testers can be disposed on the circuit board and the pin count of the probe apparatus is increased. In addition, the probe apparatus can be installed in the test tool. Accordingly, the testing efficiency of the present test tool can be substantially promoted and the cost of the overall testing can be effectively reduced.