Probe Card Segmentation for Accurate Semiconductor Temperature Measurement

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Solution Overview

Problem

As semiconductor devices increase in scale and complexity, accurately grasping the actual temperature becomes challenging due to heat generation and heat conduction issues, making it difficult to correctly correct the temperature characteristics of the temperature sensor circuit during inspection.

Innovation Solution

A method using a semiconductor inspection apparatus with a probe card featuring probes of different lengths to establish distinct contact states, allowing for accurate calculation of actual temperature characteristics and correction of temperature sensor circuits by measuring output values at multiple temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the number of terminals and probes increases to handle large-scale semiconductor devices, then the device functionality and coverage are improved, but the accuracy of temperature measurement deteriorates due to increased heat conduction and heat generation

Engineering Contradiction:

Improvedevice functionalityVSAvoidtemperature measurement accuracy

Core Design Contradiction:

Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The probe card is divided into two distinct sections: a first probe section with probes having a first length for sensing terminals, and a second probe section with probes having a second length (longer than the first) for normal terminals. This segmentation allows differential thermal management where sensing terminals are isolated from excessive heat conduction paths while normal terminals maintain full connectivity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different probe lengths are assigned to different functional regions of the semiconductor device. The first probe section uses shorter probes that contact only sensing terminals to minimize heat conduction, while the second probe section uses longer probes for normal terminals to ensure proper electrical connection. This local differentiation optimizes both measurement accuracy and device functionality.

Inventive Principle:

Principle #3Local quality

2Productivity

If all probes are in contact with the semiconductor device during inspection, then complete device functionality testing is achieved, but the actual temperature deviates from the set temperature due to heat conduction through multiple probes

Engineering Contradiction:

Improveinspection completenessVSAvoidtemperature accuracy

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The probe card segments probes into two functional groups: first probes for sensing terminals and second probes for normal terminals. During inspection, both groups can contact the device simultaneously, enabling complete functionality testing while the first probes' shorter length minimizes their heat conduction impact on temperature measurement accuracy.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first probe section acts as an intermediary between the temperature sensor circuit and the testing system. By using shorter probes that make contact only with sensing terminals, it provides a thermal isolation mechanism that allows complete device inspection while maintaining more accurate temperature measurement through reduced heat conduction pathways.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If the probe length is increased to ensure contact with all terminals, then the reliability of electrical connection is improved, but the heat conduction from the device to the probe card increases, affecting temperature measurement

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidheat conduction loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The probe card segments the probe population into two distinct length categories. Second probes have longer length to ensure reliable electrical connection with normal terminals, while first probes have shorter length to minimize heat conduction when contacting sensing terminals. This segmentation allows each probe type to be optimized for its specific function.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different probe lengths are applied locally to different terminal types based on their functional requirements. Normal terminals receive longer probes for reliable connection, while sensing terminals receive shorter probes to reduce thermal interference. This local quality differentiation optimizes both connection reliability and thermal management.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS12078659B2Method of inspecting semiconductor device, semiconductor device, and probe card

Publication Date: 2024.09.03 RENESAS ELECTRONICS CORP

AI summary

A semiconductor device includes a temperature sensor circuit having a sensor element, internal circuits, sensor terminals connected to the sensor element, and normal terminals connected to the internal circuits. A semiconductor inspection apparatus inspects, by using a probe card having first probes and second probes, the semiconductor device mounted on a stage in a first state in which the first probe is in contact with the sensor terminal and the second probe is not in contact with the semiconductor device and in a second state in which the first probe is in contact with the sensor terminal and the second probe is in contact with the normal terminal. The semiconductor inspection apparatus measures an output value of the sensor element in the first state to calculate temperature characteristics of the sensor element, and grasps a temperature of the sensor element in the second state based on the temperature characteristics.