Probe Card Temperature-Adjusting Mechanism for IC Testing
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Solution Overview
Problem
Existing integrated circuit probing apparatuses face accuracy issues due to temperature variations in the test environment, caused by heat transfer from semiconductor wafers during testing, which can lead to changes in physical and material properties of test components, affecting the reliability and precision of the testing process.
Innovation Solution
An integrated circuit probing apparatus equipped with a temperature-adjusting mechanism that uses pressurized fluid to regulate the test environment's temperature, featuring a flow line with fluid inlets and outlets to maintain optimal operating conditions for the apparatus and test units by controlling the flow of gas, liquid, or their combination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If heater is used to heat semiconductor wafer during testing, then testing capability is improved, but test environment temperature increases causing material property changes and reduced measurement accuracy
Solution Approach 1:
A temperature-adjusting mechanism with flow lines is introduced as an intermediary system between the heater and the test environment. This mechanism uses pressurized fluid (gas or liquid) to transfer heat into or out of the test environment, acting as a mediator that decouples the heating function from the test environment temperature, allowing independent control of each function.
Solution Approach 2:
The system changes the temperature parameter of the test environment by controlling the flow rate and temperature of the pressurized fluid in the flow lines. By adjusting these parameters, the test environment temperature can be maintained within a specified range despite the heater operation, preventing material property changes and ensuring measurement accuracy.
2Measurement precision
If temperature-adjusting mechanism is added to control test environment temperature, then measurement accuracy is improved, but device complexity increases
Solution Approach 1:
The flow lines are designed to serve multiple functions: they act as both temperature adjustment channels and structural support elements within the probe card assembly. The same flow line structure that controls temperature also provides mechanical stability, reducing the need for additional separate components and minimizing the increase in device complexity.
Solution Approach 2:
The system uses pressurized fluid (gas or liquid) flow through the flow lines to achieve temperature control. This pneumatic/hydraulic approach is more compact and integrates easier into the existing probe card structure compared to solid-state thermal management systems, thereby limiting the increase in device complexity while maintaining effective temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures that the test environment remains within a specified temperature range, minimizing material property variations and enhancing the accuracy of electrical property measurements by maintaining consistent operating conditions for the integrated circuit probing apparatus and its components.
Implementation Method 1
The temperature-adjusting mechanism includes at least one flow line having at least one fluid inlet and a plurality of fluid outlets, the fluid inlet can be positioned on the second surface of the circuit board
Implementation Method 2
the flow of the pressurized fluid in the flow line to adjust the temperature of the test environment
Implementation Method 3
heat is transmitted to the test environment where the probe card 10 is positioned by thermal radiation
Implementation Method 4
heat is transmitted to the test environment where the probe card 10 is positioned by thermal conduction through the tip of the probe 16
Implementation Method 5
the flow of the pressurized fluid in the flow line to adjust the temperature of the test environment
Implementation Method 6
transfer heat into or out of the testing environment by pressurized fluid
Data Source
AI summary
A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.